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TXU0102DTTR

Texas Instruments

TXU0102DTTR by Texas Instruments

TXU0102DTTR by Texas Instruments is a 2-bit bus driver with 60ns propagation delay, suitable for applications requiring true output polarity and Schmitt trigger. With a small outline package style and dual terminal position, it operates b/w -40 to 125 °C, making it ideal for low-power systems with load capacitance of 5pF.

Median Price

$0.990

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 235,903 parts In-Stock

1+ parts

$0.618

100+ parts

$0.475

1k+ parts

$0.250

10k+ parts

-

235,903

$0.618

$0.475

$0.250

-

DigiKey

USA . 13,039 parts In-Stock

1+ parts

$0.990

100+ parts

$0.564

1k+ parts

$0.488

10k+ parts

$0.448

13,039

$0.990

$0.564

$0.488

$0.448

Mouser Electronics

USA . 4,803 parts In-Stock

1+ parts

$0.990

100+ parts

$0.565

1k+ parts

-

10k+ parts

-

4,803

$0.990

$0.565

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$0.398

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$0.398

-

-

-

Digiode

USA . 1,257 parts In-Stock

1+ parts

$0.587

100+ parts

-

1k+ parts

-

10k+ parts

-

1,257

$0.587

-

-

-

Vyrian

USA . 82,672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

82,672

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,891 parts In-Stock

1+ parts

$0.398

100+ parts

-

1k+ parts

-

10k+ parts

$0.390

6,891

$0.398

-

-

$0.390

Argo Parts USA

USA . 440 parts In-Stock

1+ parts

$0.398

100+ parts

-

1k+ parts

-

10k+ parts

$0.386

440

$0.398

-

-

$0.386

Ampacity Inc.

Singapore . 82,870 parts In-Stock

1+ parts

$0.530

100+ parts

-

1k+ parts

-

10k+ parts

-

82,870

$0.530

-

-

-

Corphita

USA . 79 parts In-Stock

1+ parts

$0.556

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$0.556

-

-

-

Microchip USA

USA . 1,328 parts In-Stock

1+ parts

$2.183

100+ parts

-

1k+ parts

-

10k+ parts

-

1,328

$2.183

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.390

1k+ parts

$0.378

10k+ parts

$0.370

100

-

$0.390

$0.378

$0.370

Overview

Unleash the power of reliable communication with the TXU0102DTTR by Texas Instruments. Crafted with precision and expertise, this Bus Driver & Transceiver offers unrivaled quality and performance for your electronic projects. Whether you're designing industrial automation systems or enhancing automotive applications, this versatile component is a game-changer. With quick propagation delays and 3-STATE output characteristics, you can trust this product to deliver seamless connectivity every time. Elevate your projects with the Texas Instruments advantage and experience the difference in efficiency and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for use in buses where weight and durability are important factors.

Propagation Delay At Nominal Supply: 60 ns

The low propagation delay ensures fast data transmission, making this bus driver/transceiver efficient in communication systems.

Surface Mount: YES

Being surface mountable makes installation and replacement of this component easier and more convenient, saving time and effort.

No. of Bits: 2

With 2 bits, this product can handle multiple data signals simultaneously, increasing its versatility and applicability in bus communication systems.

Nominal Supply Voltage / Vsup (V): 1.1

Operating at a low nominal supply voltage of 1.1V, this bus driver/transceiver is energy-efficient and can help reduce power consumption in the overall system.

No. of Terminals: 8

With 8 terminals, this component can facilitate complex wiring connections, allowing for efficient signal routing and connectivity in bus applications.

Output Characteristics: 3-STATE

The 3-state output capability allows this bus driver/transceiver to drive the bus lines high, low, or enter a high-impedance state, providing flexibility in controlling the bus signals.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand elevated temperatures inside buses without malfunctioning, ensuring reliable operation in various environmental conditions.

Technical Specifications

Bus Driver & Transceivers TXU0102DTTR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

TXU

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.95 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Maximum Power Supply Current (ICC):

.0055 mA

Propagation Delay At Nominal Supply:

60 ns

Propagation Delay (tpd):

60 ns

Schmitt Trigger:

YES

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.08 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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