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TWL6032A2B7YFFT

Texas Instruments

TWL6032A2B7YFFT by Texas Instruments

TWL6032A2B7YFFT by Texas Instruments is a Power Management IC with 155 terminals, supporting 17 channels and 14 outputs. It operates in industrial temperature range (-40 to 85°C) with output voltage ranging from 0.6V to 3.3V, making it ideal for power supply support circuits.

Median Price

$10.338

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$10.339

100+ parts

$8.429

1k+ parts

$5.619

10k+ parts

-

1,500

$10.339

$8.429

$5.619

-

DigiKey

USA . 336 parts In-Stock

1+ parts

$14.440

100+ parts

$10.642

1k+ parts

$9.051

10k+ parts

-

336

$14.440

$10.642

$9.051

-

Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$8.270

1k+ parts

$7.400

10k+ parts

$6.960

250

-

$8.270

$7.400

$6.960

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$10.338

1k+ parts

$9.250

10k+ parts

$8.700

250

-

$10.338

$9.250

$8.700

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,756 parts In-Stock

1+ parts

$7.581

100+ parts

-

1k+ parts

-

10k+ parts

-

4,756

$7.581

-

-

-

Vyrian

USA . 6,709 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,709

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 534 parts In-Stock

1+ parts

$4.145

100+ parts

$384.901

1k+ parts

$3.730

10k+ parts

-

534

$4.145

$384.901

$3.730

-

DigiPath Technology Company

USA . 1,680 parts In-Stock

1+ parts

$4.564

100+ parts

-

1k+ parts

-

10k+ parts

-

1,680

$4.564

-

-

-

ChromeModa Solutions

Germany . 4,291 parts In-Stock

1+ parts

$4.657

100+ parts

$3.819

1k+ parts

-

10k+ parts

-

4,291

$4.657

$3.819

-

-

IDEA Electronic Components Group

UK . 1,621 parts In-Stock

1+ parts

$4.657

100+ parts

-

1k+ parts

$4.191

10k+ parts

-

1,621

$4.657

-

$4.191

-

Ampacity Inc.

Singapore . 636 parts In-Stock

1+ parts

$6.780

100+ parts

-

1k+ parts

-

10k+ parts

-

636

$6.780

-

-

-

Semicontronic

India . 324 parts In-Stock

1+ parts

$6.780

100+ parts

$6.610

1k+ parts

$6.577

10k+ parts

-

324

$6.780

$6.610

$6.577

-

Corphita

USA . 2,028 parts In-Stock

1+ parts

$7.182

100+ parts

-

1k+ parts

-

10k+ parts

-

2,028

$7.182

-

-

-

Corohmni

South Africa . 208 parts In-Stock

1+ parts

$7.980

100+ parts

-

1k+ parts

-

10k+ parts

-

208

$7.980

-

-

-

Modulus Dynamics

Lithuania . 50 parts In-Stock

1+ parts

$15.754

100+ parts

$15.754

1k+ parts

$15.754

10k+ parts

-

50

$15.754

$15.754

$15.754

-

Lixinc

USA . 17,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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17,406

-

-

-

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iodParts Technologies Inc.

India . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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500

-

-

-

-

Kepictronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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250

-

-

-

-

Overview

Enhance the power efficiency and performance of your electronic devices with the TWL6032A2B7YFFT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs like this one, designed for a wide range of applications. This advanced IC offers unparalleled value with its compact size, high output current, and industrial-grade temperature durability. Say goodbye to power supply issues and hello to seamless operation with the TWL6032A2B7YFFT - your ultimate solution for efficient power management.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape is commonly used for power management ICs, providing efficient space utilization.

Maximum Output Current: 5 A

Capable of delivering high current output, suitable for powering various electronic devices.

Maximum Output Voltage: 3.3 V

Provides a stable and regulated output voltage for connected components.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments with wide temperature ranges.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package with thin profile and fine pitch design enhances heat dissipation and electrical performance.

Technical Specifications

Power Management ICs TWL6032A2B7YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B155

JESD-609 Code:

e1

Length:

5.364 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

17

No. of Functions:

1

No. of Outputs:

14

No. of Terminals:

155

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.214 mm

Trade Compliance

TWL6032A2B7YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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