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TVP5020

Texas Instruments

TVP5020 by Texas Instruments

TVP5020 by Texas Instruments is a color signal decoder with 80 terminals in a square package. It operates b/w 0-70°C, with supply voltage of 4.75-5.25V and current of 105mA. Ideal for applications requiring precise color signal conversion in compact setups.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,443 parts In-Stock

1+ parts

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7,443

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Digiode

USA . 4,611 parts In-Stock

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4,611

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,160 parts In-Stock

1+ parts

$3.466

100+ parts

-

1k+ parts

$3.991

10k+ parts

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1,160

$3.466

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$3.991

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DigiPath Technology Company

USA . 864 parts In-Stock

1+ parts

$3.816

100+ parts

-

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864

$3.816

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ChromeModa Solutions

Germany . 4,956 parts In-Stock

1+ parts

$3.894

100+ parts

$3.193

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4,956

$3.894

$3.193

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IDEA Electronic Components Group

UK . 1,492 parts In-Stock

1+ parts

$3.894

100+ parts

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1k+ parts

$3.505

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1,492

$3.894

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$3.505

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One Stop Electronics

USA . 622 parts In-Stock

1+ parts

$11.800

100+ parts

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622

$11.800

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AZTECH Wire

Italy . 487 parts In-Stock

1+ parts

$17.252

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487

$17.252

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Corphita

USA . 1,909 parts In-Stock

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1,909

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Overview

Elevate your viewing experience with the TVP5020 by Texas Instruments, a top-of-the-line Color Signal Converter that promises unparalleled quality and reliability. Manufactured by the renowned Texas Instruments, this decoder is designed to deliver crisp and vibrant colors to your display. Perfect for a wide range of applications, this product offers exceptional value and benefits to customers seeking superior image quality and performance. Upgrade your entertainment system today with the TVP5020 and enjoy a whole new level of visual clarity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit board designs, saving space and simplifying assembly.

Package Shape: SQUARE

The square shape of the package provides a compact footprint and efficient use of space in electronic devices.

General IC Type: COLOR SIGNAL DECODER

As a color signal decoder, this IC type is designed specifically for processing and decoding color signals accurately and efficiently.

No. of Terminals: 80

Having 80 terminals allows for versatile connectivity options and the ability to interface with a variety of other components in a system.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch design of the package style enables high-density mounting and precise connections, ideal for modern electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can reliably operate in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C makes this product suitable for use in cold environments without sacrificing performance.

Terminal Position: QUAD

The quad terminal position provides stability and secure connections, reducing the risk of signal interference or loss.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, this product offers a low-profile design that is ideal for slim and compact electronic devices.

Width: 12 mm

The 12 mm width provides a balance between compactness and ease of handling during installation and maintenance.

Minimum Supply Voltage (Vsup): 4.75 V

The low minimum supply voltage of 4.75 V ensures efficient power consumption and compatibility with a wide range of power sources.

Length: 12 mm

The 12 mm length contributes to the overall compactness of the product, making it suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for reliability and performance in typical operating conditions.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during assembly, ensuring secure and durable connections.

Maximum Supply Current: 105 mA

With a maximum supply current of 105 mA, this product can efficiently handle the required power input without risk of overloading.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for precise and reliable connections, facilitating high-speed data transfer and signal integrity.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage of 5.25 V ensures compatibility with standard power sources and provides a reliable operating range for the product.

Technical Specifications

Color Signal Converters TVP5020 attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

105 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

TVP5020 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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