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TVP5147M1PFPRG4

Texas Instruments

TVP5147M1PFPRG4 by Texas Instruments

TVP5147M1PFPRG4 by Texas Instruments is a color signal decoder with 80 terminals, operating voltage of 1.8-3.3V, and temperature range of 0-70°C. It is used in applications requiring color signal conversion, featuring a square package shape and surface mount capability for compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,809 parts In-Stock

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4,809

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Digiode

USA . 2,019 parts In-Stock

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2,019

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,856 parts In-Stock

1+ parts

$2.779

100+ parts

-

1k+ parts

$3.263

10k+ parts

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1,856

$2.779

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$3.263

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ChromeModa Solutions

Germany . 1,225 parts In-Stock

1+ parts

$3.122

100+ parts

$2.560

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$3.122

$2.560

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IDEA Electronic Components Group

UK . 397 parts In-Stock

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$3.122

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$2.810

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397

$3.122

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$2.810

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AZTECH Wire

Italy . 886 parts In-Stock

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$12.686

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886

$12.686

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One Stop Electronics

USA . 1,104 parts In-Stock

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$19.800

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1,104

$19.800

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Corphita

USA . 3,825 parts In-Stock

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3,825

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DigiPath Technology Company

USA . 217 parts In-Stock

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$2.815

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217

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$2.815

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Overview

Enhance your color signal conversion with the TVP5147M1PFPRG4 by Texas Instruments. Experience top-notch quality and reliability from a trusted manufacturer. Ideal for a variety of applications, this color signal decoder offers unmatched value and benefits to customers. Upgrade your system with this innovative solution and enjoy seamless performance and superior results. Trust Texas Instruments to deliver excellence in every product, including the TVP5147M1PFPRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, which is ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape helps in efficient utilization of board space and can easily fit into compact electronic devices.

General IC Type: COLOR SIGNAL DECODER

Being a color signal decoder, the product is designed to accurately decode and process color signals, ensuring high-quality color reproduction in video and image applications.

Power Supplies (V): 1.8, 3.3

Support for multiple power supply voltages (1.8V and 3.3V) offers flexibility in power requirements and compatibility with various systems and applications.

No. of Terminals: 80

With 80 terminals, the product provides a high level of connectivity options for interfacing with other components and circuits.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles (flatpack, heat sink/slug, thin profile, fine pitch) cater to different installation and thermal management needs, providing versatility in design and integration.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance and longevity even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the product to function effectively in cold environments without any performance degradation.

Terminal Position: QUAD

The quad terminal position facilitates secure and stable connections, minimizing the risk of signal loss or interference.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2 mm enables a low-profile design, which is advantageous for space-constrained applications and helps in reducing overall device thickness.

Width: 12 mm

The 12mm width provides a compact form factor, making it suitable for devices with limited board space or those requiring a sleek design.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage of 1.65V ensures efficient power consumption and compatibility with low-power operation requirements.

Length: 12 mm

The 12mm length contributes to the overall compact size of the product, facilitating easy integration into small electronic devices without compromising on performance.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is designed for standard commercial applications, ensuring reliability and consistent performance in typical operating environments.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical stability during soldering and assembly processes, enhancing the product's robustness and longevity.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting on PCBs, allowing for more connections in a limited space and increasing design flexibility.

Maximum Supply Voltage (Vsup): 1.95 V

The maximum supply voltage of 1.95V ensures safe operation within specified voltage limits, protecting the product from potential overvoltage issues.

Technical Specifications

Color Signal Converters TVP5147M1PFPRG4 attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Color Signal Converters

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

TVP5147M1PFPRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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