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TDA3562A/1

STMicroelectronics

TDA3562A/1 by STMicroelectronics

TDA3562A/1 by STMicroelectronics is a color signal decoder IC with 28 terminals in an in-line package. It operates b/w 0 to 70 °C, with supply voltage ranging from 10.8V to 13.2V and max current draw of 110mA. Ideal for applications requiring precise color signal conversion and decoding in commercial-grade electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,680 parts In-Stock

1+ parts

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2,680

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Digiode

USA . 1,560 parts In-Stock

1+ parts

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1,560

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Vyrian

USA . 1,309 parts In-Stock

1+ parts

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100+ parts

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1,309

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 608 parts In-Stock

1+ parts

$2.582

100+ parts

-

1k+ parts

$2.324

10k+ parts

-

608

$2.582

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$2.324

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MKK Technologies

India . 1,281 parts In-Stock

1+ parts

$4.856

100+ parts

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10k+ parts

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1,281

$4.856

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DigiPath Technology Company

USA . 1,281 parts In-Stock

1+ parts

$4.856

100+ parts

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10k+ parts

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1,281

$4.856

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Corphita

USA . 2,463 parts In-Stock

1+ parts

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2,463

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Parana Technologies

USA . 1,514 parts In-Stock

1+ parts

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100+ parts

$3.088

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10k+ parts

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1,514

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$3.088

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Overview

Enhance your video display quality with the TDA3562A/1 by STMicroelectronics, a leading manufacturer known for top-notch components. This Color Signal Converter boasts unmatched reliability and performance, making it perfect for a wide range of applications. From vibrant colors to sharp images, this decoder ensures an exceptional viewing experience. Upgrade your technology today and see the difference with the TDA3562A/1!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices.

General IC Type: COLOR SIGNAL DECODER

Being a color signal decoder ensures accurate decoding and conversion of color signals.

No. of Terminals: 28

Having 28 terminals provides versatility and compatibility with a wide range of systems.

Package Style (Meter): IN-LINE

The in-line package style makes installation and connections convenient.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand extended usage under various conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in colder environments.

Terminal Position: DUAL

Dual terminal position allows for efficient signal transmission and connectivity.

Maximum Seated Height: 4.445 mm

The low seated height enables compact design and integration into tight spaces.

Width: 15.24 mm

The moderate width facilitates easy mounting and placement within electronic setups.

Minimum Supply Voltage (Vsup): 10.8 V

The low minimum supply voltage requirement ensures compatibility with a variety of power sources.

Length: 36.83 mm

The length provides the necessary space for terminal connections and functionality.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for standard commercial applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure and reliable connections during installation.

Maximum Supply Current: 110 mA

The maximum supply current allows for efficient power usage and operation.

Terminal Pitch: 2.54 mm

The standardized terminal pitch simplifies installation and compatibility with other components.

Maximum Supply Voltage (Vsup): 13.2 V

The high maximum supply voltage capacity ensures adequate power supply for optimal performance.

Technical Specifications

Color Signal Converters TDA3562A/1 attributes and parameters. Explore more Color Signal Converters devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

Length:

36.83 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.445 mm

Maximum Supply Current:

110 mA

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10.8 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TDA3562A/1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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