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TUSB8040ARKMT

Texas Instruments

TUSB8040ARKMT by Texas Instruments

TUSB8040ARKMT by Texas Instruments is a BUS CONTROLLER IC with 100 terminals, operating at 24 MHz clock frequency. It supports I2C and SMBUS protocols, ideal for USB applications. The chip carrier package has a square shape, measures 9mm in length and width, with a max seated height of 0.8mm.

Median Price

$6.569

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

$5.510

100+ parts

$5.400

1k+ parts

$5.290

10k+ parts

-

1,000

$5.510

$5.400

$5.290

-

Verical

USA . 70 parts In-Stock

1+ parts

$6.569

100+ parts

$6.292

1k+ parts

-

10k+ parts

-

70

$6.569

$6.292

-

-

Chip1Stop

Japan . 70 parts In-Stock

1+ parts

$7.735

100+ parts

$6.292

1k+ parts

-

10k+ parts

-

70

$7.735

$6.292

-

-

DigiKey

USA . 227 parts In-Stock

1+ parts

$14.600

100+ parts

$9.908

1k+ parts

-

10k+ parts

-

227

$14.600

$9.908

-

-

Arrow

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.292

10k+ parts

-

500

-

-

$6.292

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,472 parts In-Stock

1+ parts

$7.348

100+ parts

-

1k+ parts

-

10k+ parts

-

1,472

$7.348

-

-

-

Vyrian

USA . 6,301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,301

-

-

-

-

Chip Stock

USA . 765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

765

-

-

-

-

TME

Poland . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.262

10k+ parts

-

500

-

-

$9.262

-

Elcom Components

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,340 parts In-Stock

1+ parts

$6.962

100+ parts

-

1k+ parts

-

10k+ parts

-

3,340

$6.962

-

-

-

Microchip USA

USA . 130 parts In-Stock

1+ parts

$24.820

100+ parts

$24.650

1k+ parts

$24.650

10k+ parts

$24.470

130

$24.820

$24.650

$24.650

$24.470

Corohmni

South Africa . 17 parts In-Stock

1+ parts

$30.611

100+ parts

-

1k+ parts

-

10k+ parts

-

17

$30.611

-

-

-

Parana Technologies

USA . 1,560 parts In-Stock

1+ parts

$51.576

100+ parts

-

1k+ parts

-

10k+ parts

-

1,560

$51.576

-

-

-

DigiPath Technology Company

USA . 1,985 parts In-Stock

1+ parts

$56.792

100+ parts

-

1k+ parts

-

10k+ parts

-

1,985

$56.792

-

-

-

IDEA Electronic Components Group

UK . 904 parts In-Stock

1+ parts

$57.951

100+ parts

$55.053

1k+ parts

$52.156

10k+ parts

-

904

$57.951

$55.053

$52.156

-

ChromeModa Solutions

Germany . 111 parts In-Stock

1+ parts

$57.951

100+ parts

$47.520

1k+ parts

-

10k+ parts

-

111

$57.951

$47.520

-

-

Lixinc

USA . 3,544 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,544

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Unlock seamless connectivity with the TUSB8040ARKMT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus controllers that are perfect for a wide range of applications. From I2C to SMBUS compatibility, this versatile chip carrier offers unparalleled reliability and performance. With a compact square package style and a wide temperature grade range, this USB controller ensures optimal functionality in any environment. Trust Texas Instruments to provide cutting-edge technology that meets all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to external elements, making the product suitable for various environments and conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.26 V

With a maximum supply voltage of 1.26V, the product ensures safe and reliable operation within specified limits.

Package Shape: SQUARE

The square shape of the package provides a symmetrical and compact design, facilitating efficient placement on the circuit board.

Power Supplies (V): 1.1,3.3

Support for multiple power supply voltages (1.1V and 3.3V) allows for flexibility in system integration and compatibility with various voltage requirements.

No. of Terminals: 100

With 100 terminals, the product offers a high level of connectivity and compatibility with other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles (chip carrier, heat sink/slug, very thin profile) provide options for different mounting configurations and heat dissipation requirements.

Minimum Supply Voltage: 0.99 V

The low minimum supply voltage of 0.99V ensures efficient power consumption and operation within specified voltage ranges.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the product to function reliably in elevated temperature conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the product can operate in a wide range of temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and resistance to corrosion, ensuring long-term performance and reliability.

Terminal Position: QUAD

The quad terminal position offers a balanced configuration for easy and secure connections with other components in the system.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8mm allows for a slim profile and efficient use of space on the circuit board.

Width: 9 mm

With a width of 9mm, the product has a compact form factor that can fit into tight spaces and crowded PCB layouts.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency of 24MHz enables fast data processing and communication, making the product suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time allowed at peak reflow temperature of 30 seconds ensures efficient and safe soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering and component attachment to the circuit board.

Length: 9 mm

With a length of 9mm, the product has a compact design that aids in space-saving and efficient integration into electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures compatibility with standard operating conditions in commercial electronic devices and systems.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Being a bus controller and supporting universal serial bus (USB) technology, the product enables efficient data transfer and communication between different devices.

Technology: CMOS

Using CMOS technology provides low power consumption, high speed, and compatibility with a wide range of applications, making it an efficient choice for modern electronic systems.

Terminal Form: NO LEAD

The no-lead terminal form simplifies PCB assembly, reduces production costs, and minimizes environmental impact, making it a more sustainable choice.

Nominal Supply Voltage: 1.1 V

With a nominal supply voltage of 1.1V, the product ensures reliable operation within specified voltage parameters, contributing to system stability and performance.

Bus Compatibility: I2C; SMBUS

Support for I2C and SMBus protocols enhances compatibility with a wide range of devices and systems, making the product versatile and easy to integrate into existing configurations.

Terminal Pitch: 0.6 mm

The tight terminal pitch of 0.6mm allows for high-density mounting and connectivity, making it suitable for compact and miniaturized electronic devices.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can withstand moderate exposure to moisture during handling and storage, ensuring product reliability and longevity.

Technical Specifications

Bus Controllers TUSB8040ARKMT attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

1.05-V SUPPLY MAY BE USED AS LONG AS MINIMUM SUPPLY CONDITIONS ARE MET

Bus Compatibility:

I2C; SMBUS

Maximum Clock Frequency:

24 MHz

JESD-30 Code:

S-PQCC-N100

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SLGA100,15X15,24

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.6 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TUSB8040ARKMT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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