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TUSB1004IRNQT

Texas Instruments

TUSB1004IRNQT by Texas Instruments

TUSB1004IRNQT by Texas Instruments is a 40-terminal interface IC with 4 functions, operating at 3.3V nominal voltage and supporting up to 3.6V max supply voltage. It is designed for applications requiring a quad-channel interface circuit in a compact chip carrier package, suitable for surface mount assembly with nickel palladium gold terminal finish.

Median Price

$8.121

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,150 parts In-Stock

1+ parts

$7.012

100+ parts

$5.717

1k+ parts

$3.811

10k+ parts

-

9,150

$7.012

$5.717

$3.811

-

Mouser Electronics

USA . 1,007 parts In-Stock

1+ parts

$9.230

100+ parts

$7.850

1k+ parts

$5.260

10k+ parts

-

1,007

$9.230

$7.850

$5.260

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 324 parts In-Stock

1+ parts

$6.661

100+ parts

-

1k+ parts

-

10k+ parts

-

324

$6.661

-

-

-

Vyrian

USA . 3,697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,697

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,333 parts In-Stock

1+ parts

$5.960

100+ parts

$5.811

1k+ parts

$5.781

10k+ parts

-

4,333

$5.960

$5.811

$5.781

-

Corphita

USA . 725 parts In-Stock

1+ parts

$6.311

100+ parts

-

1k+ parts

-

10k+ parts

-

725

$6.311

-

-

-

Corohmni

South Africa . 182 parts In-Stock

1+ parts

$7.012

100+ parts

-

1k+ parts

-

10k+ parts

-

182

$7.012

-

-

-

Parana Technologies

USA . 1,822 parts In-Stock

1+ parts

$9.881

100+ parts

-

1k+ parts

$10.450

10k+ parts

-

1,822

$9.881

-

$10.450

-

ChromeModa Solutions

Germany . 3,235 parts In-Stock

1+ parts

$11.102

100+ parts

$9.104

1k+ parts

-

10k+ parts

-

3,235

$11.102

$9.104

-

-

IDEA Electronic Components Group

UK . 836 parts In-Stock

1+ parts

$11.102

100+ parts

$10.547

1k+ parts

$9.992

10k+ parts

-

836

$11.102

$10.547

$9.992

-

Ampacity Inc.

Singapore . 4,626 parts In-Stock

1+ parts

$12.970

100+ parts

-

1k+ parts

-

10k+ parts

-

4,626

$12.970

-

-

-

DigiPath Technology Company

USA . 731 parts In-Stock

1+ parts

-

100+ parts

$10.010

1k+ parts

-

10k+ parts

-

731

-

$10.010

-

-

Overview

Elevate your electronic designs with the TUSB1004IRNQT by Texas Instruments. Crafted with precision and expertise, this interface IC offers unparalleled quality and reliability. Perfect for a wide range of applications, this product boasts 4 functions in a compact chip carrier package. With a wide supply voltage range and high operating temperature, customers can trust in the durability and efficiency of this innovative solution. Experience seamless connectivity and superior performance with the TUSB1004IRNQT - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and space in the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this IC can handle robust power requirements, ensuring reliable performance in various operating conditions.

No. of Functions: 4

The multiple functions packed into one IC offer a cost-effective solution for integrating different features or capabilities in a single component.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a PCB, optimizing layout and design considerations.

No. of Terminals: 40

The high number of terminals provides flexibility for connecting to other components or peripherals, enabling versatile system integration.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

The chip carrier style with heat sink/slug enhances thermal management, ensuring proper heat dissipation and maintaining optimal performance.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for efficient power consumption and operation at lower voltages, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand elevated temperatures, making it suitable for industrial or harsh environments.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme cold conditions, providing resilience in various environmental settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Terminal Position: QUAD

The quad terminal position simplifies soldering and connection processes, facilitating easy installation and maintenance.

Maximum Seated Height: 0.8 mm

The low seated height allows for compact and slim device designs, saving space and enabling sleek and streamlined product configurations.

Width: 4 mm

The narrow width contributes to space efficiency and enables dense packing of components on a PCB, enhancing overall system integration.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure and reliable soldering during assembly processes, guaranteeing quality connections and performance.

Length: 6 mm

The moderate length provides a balanced form factor for the IC, fitting well within standard PCB layouts and mechanical constraints.

No. of Channels: 4

The multiple channels allow for parallel processing or communication paths, enhancing data transfer speeds and system efficiency.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and offers improved solderability, promoting sustainability and reliability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures compatibility with common power sources, simplifying integration and enhancing interoperability.

Terminal Pitch: 0.4 mm

The fine terminal pitch enables high-density packaging and precise connections, supporting miniaturization and advanced PCB designs.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication between different systems or devices, enabling seamless data exchange and interaction.

Technical Specifications

Other Function Interface ICs TUSB1004IRNQT attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TUSB1004IRNQT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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