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TRF3761-JIRHATG4

Texas Instruments

TRF3761-JIRHATG4 by Texas Instruments

TRF3761-JIRHATG4 by Texas Instruments is a PLL frequency synthesizer with 40 terminals, operating at -40 to 85°C. It has a supply voltage range of 4.5V to 5.25V and can withstand peak reflow temperature of 260°C for up to 30s. Ideal for industrial applications requiring precise frequency synthesis in compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,607 parts In-Stock

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4,607

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Digiode

USA . 4,210 parts In-Stock

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4,210

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,168 parts In-Stock

1+ parts

$2.500

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1,168

$2.500

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One Stop Electronics

USA . 221 parts In-Stock

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$4.500

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221

$4.500

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Semicontronic

India . 347 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

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347

$7.500

$7.312

$7.275

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AZTECH Wire

Italy . 255 parts In-Stock

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$9.576

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255

$9.576

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Parana Technologies

USA . 923 parts In-Stock

1+ parts

$13.726

100+ parts

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$14.218

10k+ parts

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923

$13.726

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$14.218

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DigiPath Technology Company

USA . 1,292 parts In-Stock

1+ parts

$15.115

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1,292

$15.115

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ChromeModa Solutions

Germany . 3,112 parts In-Stock

1+ parts

$15.423

100+ parts

$12.647

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3,112

$15.423

$12.647

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IDEA Electronic Components Group

UK . 2,107 parts In-Stock

1+ parts

$15.423

100+ parts

$14.652

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$13.881

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2,107

$15.423

$14.652

$13.881

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Corphita

USA . 2,580 parts In-Stock

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2,580

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Corohmni

South Africa . 195 parts In-Stock

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195

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Overview

Unlock precision frequency control with the TRF3761-JIRHATG4 by Texas Instruments, a top-of-the-line Phase Locked Loop (PLL) & Frequency Synthesis Circuit. Manufactured with quality and expertise, this chip carrier package offers customers unparalleled performance in a compact square design. Ideal for industrial applications, this PLL frequency synthesizer ensures reliability and accuracy even in extreme temperatures. Trust Texas Instruments to provide cutting-edge technology that delivers value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides good protection and insulation for the components inside, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic circuits, making this product suitable for modern manufacturing processes.

Nominal Supply Voltage (Vsup): 5 V

Operating at a common supply voltage of 5V, this product is compatible with a wide range of applications and power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions and extended usage.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for use in a variety of settings, including industrial and outdoor environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides good conductivity, corrosion resistance, and solderability, ensuring reliable connections in the circuit.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets the stringent requirements for performance and durability in harsh operating conditions.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, this product can be safely and reliably stored and used in various humidity environments.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits TRF3761-JIRHATG4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

DUAL MODULUS PRESCALER : 8/9, 16/17, 32/33, 64/65

Other IC type:

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

TRF3761-JIRHATG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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