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TPS4045BDR

Texas Instruments

TPS4045BDR by Texas Instruments

TPS4045BDR by Texas Instruments is a MOS peripheral driver with 8 terminals, operating b/w -40 to 85°C. It offers a max output current of 0.25A at power supplies of 3/5V. Ideal for industrial applications requiring small outline surface-mount packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,487 parts In-Stock

1+ parts

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100+ parts

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5,487

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Digiode

USA . 2,408 parts In-Stock

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2,408

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 176 parts In-Stock

1+ parts

$3.718

100+ parts

-

1k+ parts

$4.220

10k+ parts

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176

$3.718

-

$4.220

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DigiPath Technology Company

USA . 1,862 parts In-Stock

1+ parts

$4.094

100+ parts

$3.767

1k+ parts

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1,862

$4.094

$3.767

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ChromeModa Solutions

Germany . 5,168 parts In-Stock

1+ parts

$4.178

100+ parts

$3.426

1k+ parts

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5,168

$4.178

$3.426

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IDEA Electronic Components Group

UK . 69 parts In-Stock

1+ parts

$4.178

100+ parts

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1k+ parts

$3.760

10k+ parts

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69

$4.178

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$3.760

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AZTECH Wire

Italy . 384 parts In-Stock

1+ parts

$8.858

100+ parts

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384

$8.858

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One Stop Electronics

USA . 1,632 parts In-Stock

1+ parts

$31.500

100+ parts

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1,632

$31.500

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Corphita

USA . 3,701 parts In-Stock

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3,701

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Overview

Enhance performance and reliability with the TPS4045BDR by Texas Instruments. As a trusted leader in innovative technology, Texas Instruments delivers top-notch quality in the Peripheral Drivers category. This product offers unparalleled value with its compact design, dual terminal position, and industrial temperature grade. Ideal for a variety of applications, the TPS4045BDR ensures efficient power supplies with a maximum output current of 0.25 A. Experience the benefits of advanced MOS technology and secure your system's success with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and heat resistance, making it suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used in electronic components, making it easy to integrate into existing designs and layouts.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V and 5V) offers flexibility and compatibility with various system requirements.

No. of Terminals: 8

Having 8 terminals allows for sufficient connections to other components, enabling versatile functionality and communication within the system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, ideal for compact devices and designs where size is a constraint.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions and prolonged use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in very cold environments.

Terminal Position: DUAL

The dual terminal position allows for more stable connections and reduces the risk of signal interference or loss.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this product is designed to meet the stringent requirements of industrial applications, ensuring high reliability and performance.

Maximum Output Current: 0.25 A

Support for a maximum output current of 0.25 A enables the driving of peripheral devices that require higher power levels, increasing the versatility of the product.

Technology: MOS

Using Metal-Oxide-Semiconductor technology ensures efficient and precise control of peripheral drivers, enhancing overall performance and energy efficiency.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical stability and ease of soldering during the installation process, ensuring reliable connections and durability.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and compact placement of the terminals on the circuit board, facilitating efficient PCB layout and assembly.

Technical Specifications

Peripheral Drivers TPS4045BDR attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.25 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TPS4045BDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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