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TPS4055BDR

Texas Instruments

TPS4055BDR by Texas Instruments

TPS4055BDR by Texas Instruments is a MOS peripheral driver with 8 terminals, operating b/w -40°C to 85°C. It offers dual terminal position, 0.25A output current at 3/5V power supplies. Ideal for industrial applications requiring small outline surface mount packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,976 parts In-Stock

1+ parts

-

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5,976

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Digiode

USA . 2,541 parts In-Stock

1+ parts

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-

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2,541

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 595 parts In-Stock

1+ parts

$8.766

100+ parts

-

1k+ parts

$9.449

10k+ parts

-

595

$8.766

-

$9.449

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DigiPath Technology Company

USA . 1,267 parts In-Stock

1+ parts

$9.653

100+ parts

$8.881

1k+ parts

-

10k+ parts

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1,267

$9.653

$8.881

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IDEA Electronic Components Group

UK . 1,959 parts In-Stock

1+ parts

$9.850

100+ parts

$9.358

1k+ parts

$8.865

10k+ parts

-

1,959

$9.850

$9.358

$8.865

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ChromeModa Solutions

Germany . 312 parts In-Stock

1+ parts

$9.850

100+ parts

$8.077

1k+ parts

-

10k+ parts

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312

$9.850

$8.077

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AZTECH Wire

Italy . 357 parts In-Stock

1+ parts

$17.848

100+ parts

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357

$17.848

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One Stop Electronics

USA . 863 parts In-Stock

1+ parts

$19.500

100+ parts

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863

$19.500

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Corphita

USA . 3,986 parts In-Stock

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3,986

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the TPS4055BDR peripheral driver. Designed for industrial applications, this compact device offers a wide range of benefits, including efficient power supplies, dual terminal positions, and a maximum output current of 0.25A. With Texas Instruments' renowned reputation for excellence, you can trust that the TPS4055BDR will deliver consistent performance and lasting value for your projects. Upgrade to the best in the industry and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the driver, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing manufacturing costs.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies provides flexibility in compatibility with various systems and devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the driver to function reliably even in industrial environments with elevated temperatures.

Technology: MOS

The use of MOS technology ensures efficient and low-power operation, making the driver suitable for energy-efficient applications.

Technical Specifications

Peripheral Drivers TPS4055BDR attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.25 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TPS4055BDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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