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TPS3307-18DG4

Texas Instruments

TPS3307-18DG4 by Texas Instruments

TPS3307-18DG4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 8 terminals, and adjustable threshold voltages of +1.25V, 1.68V, and 2.93V. It is ideal for power supply support circuits in industrial applications due to its small outline package style and CMOS technology.

Median Price

$3.585

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 429 parts In-Stock

1+ parts

$2.920

100+ parts

$1.820

1k+ parts

$1.360

10k+ parts

-

429

$2.920

$1.820

$1.360

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Mouser Electronics

USA . 914 parts In-Stock

1+ parts

$4.250

100+ parts

$3.120

1k+ parts

$2.660

10k+ parts

$2.360

914

$4.250

$3.120

$2.660

$2.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 61 parts In-Stock

1+ parts

$3.350

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61

$3.350

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Digiode

USA . 2,748 parts In-Stock

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$4.038

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2,748

$4.038

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Chip Stock

USA . 27,100 parts In-Stock

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Vyrian

USA . 5,467 parts In-Stock

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5,467

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

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60

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Holdelec - ElecDif-Pro

France . 51 parts In-Stock

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51

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Inventory MP

USA . 8 parts In-Stock

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8

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Bristol Electronics

USA . 8 parts In-Stock

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8

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EMSNET

USA . 7 parts In-Stock

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Distributors (Availability)

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Argo Parts USA

USA . 4,962 parts In-Stock

1+ parts

$2.510

100+ parts

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4,962

$2.510

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Continental Prestige Electronics

USA . 3,622 parts In-Stock

1+ parts

$2.510

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$2.460

3,622

$2.510

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-

$2.460

Netroflash

USA . 500 parts In-Stock

1+ parts

$3.350

100+ parts

-

1k+ parts

$3.182

10k+ parts

$3.115

500

$3.350

-

$3.182

$3.115

Semicontronic

India . 1,233 parts In-Stock

1+ parts

$3.610

100+ parts

$3.520

1k+ parts

$3.502

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1,233

$3.610

$3.520

$3.502

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Ampacity Inc.

Singapore . 712 parts In-Stock

1+ parts

$3.610

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712

$3.610

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Corphita

USA . 1,735 parts In-Stock

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$3.825

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1,735

$3.825

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Advanced Electronics

New Zealand . 864 parts In-Stock

1+ parts

$3.886

100+ parts

$3.575

1k+ parts

$3.350

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864

$3.886

$3.575

$3.350

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Corohmni

South Africa . 433 parts In-Stock

1+ parts

$4.938

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433

$4.938

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Parana Technologies

USA . 1,856 parts In-Stock

1+ parts

$5.793

100+ parts

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1k+ parts

$6.583

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1,856

$5.793

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$6.583

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ChromeModa Solutions

Germany . 2,094 parts In-Stock

1+ parts

$6.509

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$5.337

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2,094

$6.509

$5.337

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IDEA Electronic Components Group

UK . 811 parts In-Stock

1+ parts

$6.509

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$5.858

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811

$6.509

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$5.858

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AZTECH Wire

Italy . 894 parts In-Stock

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$16.530

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894

$16.530

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QUARKTWIN TECHNOLOGY LTD

USA . 11,494 parts In-Stock

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Microchip USA

USA . 3,618 parts In-Stock

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3,618

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DigiPath Technology Company

USA . 1,458 parts In-Stock

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$5.869

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1,458

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$5.869

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Perfect Parts

USA . 1,018 parts In-Stock

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1,018

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Cyclops Electronics Ltd (Excess)

UK . 60 parts In-Stock

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60

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Glotronic Ltd.

UK . 48 parts In-Stock

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48

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Overview

Elevate your power management game with the TPS3307-18DG4 by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers top-notch performance for a wide range of applications. With its small outline package and industrial-grade temperature tolerance, this versatile IC ensures reliable operation in challenging environments. Say goodbye to power supply issues and hello to seamless functionality with the TPS3307-18DG4. Experience the quality and innovation that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3V provides a stable power source for the device, ensuring efficient performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high heat conditions, increasing its durability.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, making it energy-efficient.

Adjustable Threshold: YES

The ability to adjust the threshold voltage allows for customization and optimization of the device's performance based on specific requirements.

Technical Specifications

Power Management ICs TPS3307-18DG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V; MANUAL RESET INPUT; POWER-ON RESET GENERATOR

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.25,1.68,2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS3307-18DG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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