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TPS3305-33DGNG4

Texas Instruments

TPS3305-33DGNG4 by Texas Instruments

TPS3305-33DGNG4 by Texas Instruments is a Power Management IC with 2/6 V power supplies, +2.93V nominal threshold voltage, and 0.04 mA max supply current. Ideal for industrial applications requiring dual-channel power supply management circuits in a small outline package with nickel palladium gold terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,316 parts In-Stock

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4,316

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Digiode

USA . 1,122 parts In-Stock

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1,122

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 465 parts In-Stock

1+ parts

$0.500

100+ parts

-

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465

$0.500

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Andel Nordic

Denmark . 71 parts In-Stock

1+ parts

$4.965

100+ parts

-

1k+ parts

$4.767

10k+ parts

$4.767

71

$4.965

-

$4.767

$4.767

AZTECH Wire

Italy . 315 parts In-Stock

1+ parts

$5.328

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315

$5.328

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Ampacity Inc.

Singapore . 467 parts In-Stock

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$6.500

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467

$6.500

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Parana Technologies

USA . 2,261 parts In-Stock

1+ parts

$13.271

100+ parts

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$13.775

10k+ parts

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2,261

$13.271

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$13.775

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DigiPath Technology Company

USA . 221 parts In-Stock

1+ parts

$14.613

100+ parts

$13.444

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221

$14.613

$13.444

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ChromeModa Solutions

Germany . 5,167 parts In-Stock

1+ parts

$14.911

100+ parts

$12.227

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5,167

$14.911

$12.227

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IDEA Electronic Components Group

UK . 661 parts In-Stock

1+ parts

$14.911

100+ parts

$14.165

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$13.420

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661

$14.911

$14.165

$13.420

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Continental Prestige Electronics

USA . 6,974 parts In-Stock

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Corphita

USA . 2,354 parts In-Stock

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Microchip USA

USA . 1,397 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Argo Parts USA

USA . 13 parts In-Stock

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Overview

Looking for reliable power management solutions? Look no further than the TPS3305-33DGNG4 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs for a variety of applications. With a small outline package and dual terminal position, this product offers convenience and efficiency. Experience peace of mind knowing your power supply is in good hands with the TPS3305-33DGNG4. Upgrade your power management system today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protects the inner components of the Power Management IC, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes the installation of this Power Management IC easy and efficient, suitable for modern assembly processes.

Nominal Supply Voltage (Vsup): 5 V

With a standardized nominal supply voltage of 5V, this Power Management IC can easily integrate into various systems without the need for additional voltage converters.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in challenging thermal environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this Power Management IC to operate effectively in cold climates or industrial applications.

Technology: CMOS

The CMOS technology used in this Power Management IC offers low power consumption and high noise immunity, making it an efficient choice for power management applications.

Technical Specifications

Power Management ICs TPS3305-33DGNG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD IS 4.55V, POWER ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS3305-33DGNG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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