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TPS25854QRPQRQ1

Texas Instruments

TPS25854QRPQRQ1 by Texas Instruments

TPS25854QRPQRQ1 by Texas Instruments is a Power Management IC with 25 terminals, operating b/w -45 to 125 °C. It supports 5 channels and has an adjustable threshold voltage of 1.3V, suitable for power supply support circuits in automotive applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,325 parts In-Stock

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4,325

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Chip Stock

USA . 2,750 parts In-Stock

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2,750

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Digiode

USA . 1,643 parts In-Stock

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1,643

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Distributors (Availability)

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Semicontronic

India . 993 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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993

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 805 parts In-Stock

1+ parts

$5.500

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805

$5.500

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One Stop Electronics

USA . 1,055 parts In-Stock

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$6.500

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1,055

$6.500

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AZTECH Wire

Italy . 250 parts In-Stock

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$7.851

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250

$7.851

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Parana Technologies

USA . 278 parts In-Stock

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$13.441

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$13.959

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278

$13.441

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$13.959

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DigiPath Technology Company

USA . 2,297 parts In-Stock

1+ parts

$14.800

100+ parts

$13.616

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2,297

$14.800

$13.616

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ChromeModa Solutions

Germany . 2,124 parts In-Stock

1+ parts

$15.102

100+ parts

$12.384

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2,124

$15.102

$12.384

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IDEA Electronic Components Group

UK . 888 parts In-Stock

1+ parts

$15.102

100+ parts

$14.347

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$13.592

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888

$15.102

$14.347

$13.592

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Lixinc

USA . 4,767 parts In-Stock

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4,767

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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A-Z Elektronik GmbH

Germany . 2,714 parts In-Stock

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2,714

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Corphita

USA . 1,133 parts In-Stock

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Corohmni

South Africa . 96 parts In-Stock

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96

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Overview

Elevate your power management game with the TPS25854QRPQRQ1 by Texas Instruments, a top-of-the-line solution designed to meet the highest industry standards. Crafted with precision and reliability in mind, this Power Management IC offers unparalleled performance and efficiency for a wide range of applications. From automotive to industrial, this chip carrier is engineered to deliver optimal power supply support without compromising on quality. Trust Texas Instruments to provide cutting-edge technology that ensures your systems run smoothly and efficiently every time. Experience the difference with the TPS25854QRPQRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the inner components of the power management IC, ensuring a longer lifespan.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

AEC-Q100 certification ensures that the power management IC meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

Nominal Supply Voltage (Vsup): 13.5 V

The nominal supply voltage of 13.5 V makes this power management IC compatible with a wide range of electronic devices and systems.

No. of Terminals: 25

Having 25 terminals allows for connectivity to multiple components and peripherals, increasing the versatility of the power management IC.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient heat dissipation and space-saving design for compact electronic devices.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this power management IC can withstand high temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -45 °C

The minimum operating temperature of -45°C allows the power management IC to function in cold environments without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for optimal performance.

Terminal Position: QUAD

The quad terminal position offers a secure and stable connection to the circuit board, preventing signal loss or interference.

Maximum Seated Height: 1 mm

The maximum seated height of 1 mm allows for a low-profile design, making it suitable for compact electronic devices with limited space.

Width (mm): 3.5 mm

The slim width of 3.5 mm enables easy integration into tight spaces on the circuit board, maximizing the efficiency of electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this power management IC can regulate and distribute power effectively, ensuring stable operation of electronic devices.

Minimum Supply Voltage (Vsup): 5.5 V

The minimum supply voltage of 5.5 V allows the power management IC to function even with lower power sources, expanding its compatibility with various systems.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures secure soldering during assembly, preventing any mechanical or electrical failures.

Length: 4.5 mm

The compact length of 4.5 mm facilitates easy placement on the circuit board, optimizing space utilization in electronic devices.

Nominal Threshold Voltage (V): 1.3

The nominal threshold voltage of 1.3 V ensures accurate voltage detection and regulation, contributing to the overall stability and performance of the electronic system.

No. of Channels: 5

Having 5 channels enables the power management IC to manage multiple power sources or outputs simultaneously, enhancing overall efficiency and flexibility.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and reduces the risk of lead contamination, making it environmentally friendly and compliant with regulations.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5 mm ensures secure connections and reduces signal interference, enhancing the reliability and performance of the power management IC.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this power management IC can withstand moderate exposure to moisture during storage and assembly, ensuring long-term reliability in various operating conditions.

Maximum Supply Voltage (Vsup): 26 V

The maximum supply voltage of 26 V allows the power management IC to handle higher voltage inputs, making it suitable for a wide range of applications requiring higher power ratings.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization of voltage levels according to specific requirements, providing flexibility and adaptability in different electronic systems.

Technical Specifications

Power Management ICs TPS25854QRPQRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PQCC-N25

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

5

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-45 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC25,.15X.19,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

26 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

1.3

Width (mm):

3.5 mm

Trade Compliance

TPS25854QRPQRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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