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TPS24711DGS

Texas Instruments

TPS24711DGS by Texas Instruments

TPS24711DGS by Texas Instruments is a Power Management IC with 12V nominal voltage and 500A max output current. It features a small outline, thin profile package style suitable for industrial applications. With adjustable threshold and surface mount capability, it is ideal for power supply support circuits.

Median Price

$2.626

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 29,680 parts In-Stock

1+ parts

$2.626

100+ parts

$2.301

1k+ parts

$1.300

10k+ parts

-

29,680

$2.626

$2.301

$1.300

-

Mouser Electronics

USA . 130 parts In-Stock

1+ parts

$5.750

100+ parts

$2.940

1k+ parts

$2.180

10k+ parts

$2.110

130

$5.750

$2.940

$2.180

$2.110

Arrow

USA . 240 parts In-Stock

1+ parts

-

100+ parts

$1.734

1k+ parts

-

10k+ parts

-

240

-

$1.734

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,855 parts In-Stock

1+ parts

$2.495

100+ parts

-

1k+ parts

-

10k+ parts

-

3,855

$2.495

-

-

-

Vyrian

USA . 6,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,668

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,813 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

-

9,813

$1.720

-

-

-

Semicontronic

India . 9,758 parts In-Stock

1+ parts

$1.720

100+ parts

$1.677

1k+ parts

$1.668

10k+ parts

-

9,758

$1.720

$1.677

$1.668

-

Corohmni

South Africa . 339 parts In-Stock

1+ parts

$2.019

100+ parts

-

1k+ parts

-

10k+ parts

-

339

$2.019

-

-

-

Corphita

USA . 3,219 parts In-Stock

1+ parts

$2.363

100+ parts

-

1k+ parts

-

10k+ parts

-

3,219

$2.363

-

-

-

Parana Technologies

USA . 292 parts In-Stock

1+ parts

$8.540

100+ parts

-

1k+ parts

$9.198

10k+ parts

-

292

$8.540

-

$9.198

-

ChromeModa Solutions

Germany . 2,733 parts In-Stock

1+ parts

$9.595

100+ parts

$7.868

1k+ parts

-

10k+ parts

-

2,733

$9.595

$7.868

-

-

IDEA Electronic Components Group

UK . 1,332 parts In-Stock

1+ parts

$9.595

100+ parts

$9.115

1k+ parts

$8.636

10k+ parts

-

1,332

$9.595

$9.115

$8.636

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,000

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 2,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,974

-

-

-

-

DigiPath Technology Company

USA . 1,680 parts In-Stock

1+ parts

-

100+ parts

$8.651

1k+ parts

-

10k+ parts

-

1,680

-

$8.651

-

-

Perfect Parts

USA . 358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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358

-

-

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-

Overview

Upgrade your power management system with the TPS24711DGS by Texas Instruments. Manufactured with top-quality materials and cutting-edge technology, this Power Management IC is designed to provide reliable performance in a variety of applications. From industrial settings to consumer electronics, this product offers a wide range of benefits including efficient power supply support, adjustable threshold, and a compact design for easy integration. Trust Texas Instruments for superior quality and innovation that will take your power management to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good thermal insulation and electrical insulation, ensuring the reliability and durability of the power management IC.

Nominal Supply Voltage (Vsup): 12 V

A commonly used voltage level in electrical systems, making it compatible with a wide range of applications.

No. of Terminals: 10

Sufficient number of terminals for providing power and control connections, allowing for versatility in usage.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance ensures stable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for usage in both cold and hot conditions without compromising performance.

Maximum Output Current: 500 A

Capable of handling high current loads, making it suitable for power-intensive applications.

Technical Specifications

Power Management ICs TPS24711DGS attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1.4 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS24711DGS Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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