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TPS2376PWG4

Texas Instruments

TPS2376PWG4 by Texas Instruments

TPS2376PWG4 by Texas Instruments is a Power Management IC with 8 terminals, operating at -40 to 85°C. It supports a nominal voltage of 48V and peak reflow temperature of 260°C. This IC is ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,692 parts In-Stock

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6,692

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Digiode

USA . 1,896 parts In-Stock

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1,896

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Distributors (Availability)

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One Stop Electronics

USA . 934 parts In-Stock

1+ parts

$0.500

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-

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934

$0.500

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Semicontronic

India . 727 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

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$3.395

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727

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 1,516 parts In-Stock

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$6.500

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1,516

$6.500

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AZTECH Wire

Italy . 710 parts In-Stock

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$17.503

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710

$17.503

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Parana Technologies

USA . 349 parts In-Stock

1+ parts

$22.026

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$22.577

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349

$22.026

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$22.577

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DigiPath Technology Company

USA . 1,366 parts In-Stock

1+ parts

$24.253

100+ parts

$22.313

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1,366

$24.253

$22.313

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ChromeModa Solutions

Germany . 6,733 parts In-Stock

1+ parts

$24.748

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$20.293

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6,733

$24.748

$20.293

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IDEA Electronic Components Group

UK . 1,764 parts In-Stock

1+ parts

$24.748

100+ parts

$23.511

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$22.273

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1,764

$24.748

$23.511

$22.273

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Corphita

USA . 3,427 parts In-Stock

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3,427

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Microchip USA

USA . 1,900 parts In-Stock

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1,900

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Corohmni

South Africa . 172 parts In-Stock

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172

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Overview

Enhance your power management solutions with the TPS2376PWG4 by Texas Instruments. This high-quality Power Management IC offers superior performance and reliability, making it the perfect choice for a wide range of applications. With its compact design and advanced features, this product provides unmatched value, efficiency, and convenience to customers. Trust Texas Instruments for innovative technology that meets all your power supply needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability for the Power Management IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly process.

Nominal Supply Voltage (Vsup): 48 V

Designed for a nominal supply voltage of 48V which is suitable for many industrial applications.

Maximum Operating Temperature: 85 °C

Ability to operate at a maximum temperature of 85 °C ensures reliable performance even under high temperature conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance.

Width (mm): 3 mm

Small width of 3 mm allows for compact design and space-saving on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the Power Management IC can operate in harsh environmental conditions.

Maximum Supply Current (Isup): 0.45 mA

Low maximum supply current of 0.45 mA helps in reducing power consumption and energy efficiency.

Technical Specifications

Power Management ICs TPS2376PWG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TPS2376PWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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