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TPS2350PWRG4

Texas Instruments

TPS2350PWRG4 by Texas Instruments

TPS2350PWRG4 by Texas Instruments is a Power Management IC with -48V power supplies, 500A max output current, and adjustable threshold. It is used in industrial applications for power supply support circuits due to its small outline package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,931 parts In-Stock

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Digiode

USA . 1,321 parts In-Stock

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1,321

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Semicontronic

India . 140 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

140

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 1,322 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 568 parts In-Stock

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$12.567

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568

$12.567

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Parana Technologies

USA . 2,363 parts In-Stock

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$17.436

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$17.639

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2,363

$17.436

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$17.639

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DigiPath Technology Company

USA . 432 parts In-Stock

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$19.199

100+ parts

$17.663

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432

$19.199

$17.663

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ChromeModa Solutions

Germany . 2,815 parts In-Stock

1+ parts

$19.591

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$16.065

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2,815

$19.591

$16.065

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IDEA Electronic Components Group

UK . 200 parts In-Stock

1+ parts

$19.591

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$18.611

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$17.632

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200

$19.591

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$17.632

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Microchip USA

USA . 4,061 parts In-Stock

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Corphita

USA . 3,818 parts In-Stock

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Corohmni

South Africa . 171 parts In-Stock

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Overview

Enhance your power management solutions with the TPS2350PWRG4 by Texas Instruments. Designed with top-notch quality and reliability, this Power Management IC offers unmatched performance for a wide range of applications. From industrial settings to consumer electronics, this product ensures optimal power supply support without compromising on efficiency. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Experience the value and benefits of the TPS2350PWRG4 today and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and low cost, making the product reliable and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the PCB, making it ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape is standard and convenient for handling, assembly, and integration into circuit designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain optimal performance.

Width (mm): 4.4 mm

The small width of the package allows for efficient use of space on the circuit board, especially in tight layouts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This feature indicates that the product is specifically designed to support power supply functions, ensuring reliable and stable power management.

Nominal Negative Supply Voltage (Vsup): -48 V

The negative supply voltage of -48V is ideal for powering certain components or systems that require a negative voltage source.

Maximum Output Current: 500 A

With a high maximum output current, this product can efficiently handle large loads and power consumption, making it versatile for various applications.

Technical Specifications

Power Management ICs TPS2350PWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

IT OPERATES FROM A -12V TO -80V SUPPLY

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage (Vsup):

-48 V

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-48

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2 mA

Maximum Supply Voltage (Vsup):

-12 V

Minimum Supply Voltage (Vsup):

-80 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

TPS2350PWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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