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TPS2331IPWRG4

Texas Instruments

TPS2331IPWRG4 by Texas Instruments

TPS2331IPWRG4 by Texas Instruments is a Power Management IC with 14 terminals, Vsup ranging from 3V to 13V. It has a small outline package style, suitable for industrial applications with an operating temperature range of -40°C to 85°C. The IC supports power supplies of 3.3/5,3/13V and features adjustable threshold levels.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 18,515 parts In-Stock

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Vyrian

USA . 8,090 parts In-Stock

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Digiode

USA . 1,925 parts In-Stock

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Semi Source

USA . 130 parts In-Stock

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130

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One Stop Electronics

USA . 888 parts In-Stock

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$4.500

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888

$4.500

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AZTECH Wire

Italy . 721 parts In-Stock

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$5.141

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721

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Parana Technologies

USA . 474 parts In-Stock

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$20.526

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$20.599

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474

$20.526

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$20.599

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DigiPath Technology Company

USA . 73 parts In-Stock

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$22.602

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73

$22.602

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ChromeModa Solutions

Germany . 2,140 parts In-Stock

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$23.063

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$18.912

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$23.063

$18.912

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IDEA Electronic Components Group

UK . 687 parts In-Stock

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$23.063

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$21.910

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$20.757

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687

$23.063

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$20.757

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Kepictronics

USA . 20,000 parts In-Stock

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Corphita

USA . 1,921 parts In-Stock

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Microchip USA

USA . 331 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the TPS2331IPWRG4 Power Management IC. Designed for a variety of applications, this sleek and innovative product offers unparalleled value to our customers. With a compact package shape, dual terminal position, and adjustable threshold, the TPS2331IPWRG4 is a versatile solution for power supply support circuits. Trust Texas Instruments for cutting-edge technology and exceptional performance in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material for package body makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Nominal Supply Voltage (Vsup): 4.5 V

Ideal nominal supply voltage for stable operation and compatibility with a wide range of applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in industrial environments.

Width (mm): 4.4 mm

Compact width allows for space-saving installation in tight layouts.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage enables operation in power-constrained scenarios.

Adjustable Threshold: YES

Adjustable threshold feature provides flexibility in customizing the device to specific requirements.

Technical Specifications

Power Management ICs TPS2331IPWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

REQUIRES 3V TO 5.5V SUPPLY FOR CHANNEL 2

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,3/13

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

13 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

TPS2331IPWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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