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TPS2300IPWRG4

Texas Instruments

TPS2300IPWRG4 by Texas Instruments

TPS2300IPWRG4 by Texas Instruments is a Power Management IC with 20 terminals, operating at -40 to 85°C. It supports supply voltages of 3-13V and has a peak reflow temperature of 260°C. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,398 parts In-Stock

1+ parts

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8,398

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QIE Inc.

USA . 5,060 parts In-Stock

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5,060

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Digiode

USA . 3,076 parts In-Stock

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3,076

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,291 parts In-Stock

1+ parts

$2.500

100+ parts

-

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1,291

$2.500

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One Stop Electronics

USA . 1,564 parts In-Stock

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$5.500

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1,564

$5.500

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Parana Technologies

USA . 1,506 parts In-Stock

1+ parts

$11.706

100+ parts

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$12.094

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1,506

$11.706

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$12.094

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DigiPath Technology Company

USA . 2,096 parts In-Stock

1+ parts

$12.890

100+ parts

$11.859

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2,096

$12.890

$11.859

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ChromeModa Solutions

Germany . 2,229 parts In-Stock

1+ parts

$13.153

100+ parts

$10.785

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2,229

$13.153

$10.785

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IDEA Electronic Components Group

UK . 1,736 parts In-Stock

1+ parts

$13.153

100+ parts

$12.495

1k+ parts

$11.838

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1,736

$13.153

$12.495

$11.838

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AZTECH Wire

Italy . 844 parts In-Stock

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$15.545

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844

$15.545

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Microchip USA

USA . 3,259 parts In-Stock

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3,259

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Corphita

USA . 1,872 parts In-Stock

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1,872

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Overview

Power up your devices with the TPS2300IPWRG4 by Texas Instruments, a high-quality Power Management IC designed to meet the demands of various applications. With a compact package body material and surface mount capabilities, this product offers unparalleled convenience and efficiency. From industrial to consumer electronics, this versatile IC provides seamless power supply support with adjustable thresholds and dual terminal positions. Trust in Texas Instruments for reliable solutions that deliver optimal performance and value to customers. Elevate your designs with the TPS2300IPWRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package material ensures a lightweight and cost-effective solution for power management.

Surface Mount: YES

Being surface mount enables easy and convenient installation on circuit boards, reducing assembly time and cost.

Nominal Supply Voltage (Vsup): 4.5 V

The 4.5V nominal supply voltage provides a stable power source for various applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this power management IC can withstand higher temperatures, making it suitable for industrial applications.

No. of Channels: 2

Having 2 channels allows for managing power distribution and control for multiple devices or subsystems simultaneously.

Technical Specifications

Power Management ICs TPS2300IPWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

REQUIRES 3V TO 5.5V SUPPLY FOR CHANNEL 2

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,3/13

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

13 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

TPS2300IPWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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