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TPS22945DCKRG4

Texas Instruments

TPS22945DCKRG4 by Texas Instruments

TPS22945DCKRG4 by Texas Instruments is a power management IC with a nominal voltage of 1.8V and max operating temperature of 85°C. It is used as a power supply support circuit in industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 30,210 parts In-Stock

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Vyrian

USA . 2,067 parts In-Stock

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2,067

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Digiode

USA . 1,551 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Semicontronic

India . 1,168 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

1,168

$0.500

$0.488

$0.485

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$2.000

100+ parts

$1.900

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$1.900

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1,000

$2.000

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$1.900

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One Stop Electronics

USA . 641 parts In-Stock

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$2.500

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641

$2.500

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AZTECH Wire

Italy . 461 parts In-Stock

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$6.983

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$6.983

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Ampacity Inc.

Singapore . 869 parts In-Stock

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$7.500

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869

$7.500

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Parana Technologies

USA . 1,237 parts In-Stock

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$12.821

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$1,190.656

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$11.539

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1,237

$12.821

$1,190.656

$11.539

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DigiPath Technology Company

USA . 367 parts In-Stock

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$14.118

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$12.988

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367

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ChromeModa Solutions

Germany . 5,380 parts In-Stock

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$14.406

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$11.813

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IDEA Electronic Components Group

UK . 527 parts In-Stock

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$14.406

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$13.686

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$12.965

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527

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Corohmni

South Africa . 306 parts In-Stock

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$21.703

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Continental Prestige Electronics

USA . 6,206 parts In-Stock

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Corphita

USA . 2,499 parts In-Stock

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Microchip USA

USA . 2,182 parts In-Stock

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Argo Parts USA

USA . 198 parts In-Stock

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Bastille Electronics

Australia . 21 parts In-Stock

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Overview

Discover the TPS22945DCKRG4 by Texas Instruments, a high-quality Power Management IC that offers incredible value and benefits. Manufactured by Texas Instruments, a leading industry player known for their excellence in technology, this product is perfect for various applications. Its small outline, thin profile, and shrink pitch package make it versatile and easy to use. With a nominal supply voltage of 1.8V and a minimum supply voltage of 1.62V, it provides efficient power supply support. The TPS22945DCKRG4 is designed to operate in industrial temperature grades, making it reliable in any environment. Experience enhanced performance and reliability with this exceptional Power Management IC from Texas Instruments.

Feature Benefit Bullets

Package Body Material

Made of plastic/epoxy, providing durability and reliable performance.

Surface Mount

Allows easy and efficient installation on circuit boards.

No. of Functions

Offers a single integrated function, simplifying design and reducing component count.

Nominal Supply Voltage (Vsup)

Operates at a low voltage of 1.8 V, ensuring energy efficiency and compatibility with various systems.

Package Style

Features a small outline, thin profile, and shrink pitch design, saving valuable space on the circuit board.

Maximum Operating Temperature

Withstands high temperatures up to 85°C, ensuring stable operation in hotter environments.

Terminal Finish

Nickel/palladium/gold terminal finish provides excellent corrosion resistance, enhancing longevity and reliability.

Maximum Seated Height

With a compact height of only 1.1 mm, it can be seamlessly integrated into space-constrained designs.

Temperature Grade

Designed for industrial use, ensuring reliable operation in demanding conditions.

No. of Channels

Offers a single channel, delivering precise power management for specific applications.

Terminal Form

Gull wing terminal form facilitates easy soldering and enhances mechanical stability.

Maximum Supply Voltage (Vsup)

Can handle a wide voltage range of up to 5.5 V, making it compatible with a variety of power sources.

Maximum Supply Current (Isup)

Consumes a minimal current of only 0.08 mA for efficient power usage.

Moisture Sensitivity Level (MSL)

Features a moisture sensitivity level of 1, ensuring protection against moisture-related issues and prolonging product lifespan.

Package Shape

Designed in a rectangular shape, enabling convenient integration into different system layouts.

Minimum Operating Temperature

Can operate reliably even in extremely low temperatures as low as -40°C.

Terminal Position

Dual terminal position allows flexibility in circuit board layout and improves connectivity.

Width

Ultra-slim width of 1.25 mm minimizes the space required for installation.

Other IC type

Functions as a power supply support circuit, ensuring stable and efficient power delivery.

Minimum Supply Voltage (Vsup)

Operates at a minimum supply voltage of 1.62 V, enabling compatibility with low-power devices.

Peak Reflow Temperature

Can sustain peak reflow temperatures up to 260°C during manufacturing processes.

Length

Compact length of 2 mm for easy integration into various devices and systems.

Technical Specifications

Power Management ICs TPS22945DCKRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.62 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.25 mm

Trade Compliance

TPS22945DCKRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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