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TPS2056ADR

Texas Instruments

TPS2056ADR by Texas Instruments

TPS2056ADR by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and peak reflow temperature of 260°C. It is used in power supply support circuits for applications requiring small outline packages and surface mount capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,484 parts In-Stock

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4,484

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Vyrian

USA . 2,834 parts In-Stock

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2,834

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Distributors (Availability)

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Semicontronic

India . 1,470 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,470

$1.500

$1.462

$1.455

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AZTECH Wire

Italy . 466 parts In-Stock

1+ parts

$5.467

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466

$5.467

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One Stop Electronics

USA . 510 parts In-Stock

1+ parts

$5.500

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-

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510

$5.500

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Ampacity Inc.

Singapore . 1,459 parts In-Stock

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$7.500

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1,459

$7.500

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Parana Technologies

USA . 1,217 parts In-Stock

1+ parts

$10.782

100+ parts

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$11.264

10k+ parts

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1,217

$10.782

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$11.264

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DigiPath Technology Company

USA . 2,163 parts In-Stock

1+ parts

$11.873

100+ parts

$10.923

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2,163

$11.873

$10.923

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ChromeModa Solutions

Germany . 5,786 parts In-Stock

1+ parts

$12.115

100+ parts

$9.934

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5,786

$12.115

$9.934

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IDEA Electronic Components Group

UK . 249 parts In-Stock

1+ parts

$12.115

100+ parts

$11.509

1k+ parts

$10.904

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249

$12.115

$11.509

$10.904

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A-Z Elektronik GmbH

Germany . 5,234 parts In-Stock

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5,234

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Corphita

USA . 729 parts In-Stock

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729

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Corohmni

South Africa . 119 parts In-Stock

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Overview

Experience superior power management with the TPS2056ADR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are designed for efficiency and reliability. The TPS2056ADR is perfect for a wide range of applications, offering customers the value of seamless power supply support circuitry. Trust in Texas Instruments to provide you with the best-in-class solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product light-weight and cost-effective.

Surface Mount: YES

Enables easy and efficient mounting on PCBs, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, maximizing component placement.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with standard voltage requirements in many electronic devices, ensuring wide applicability.

No. of Terminals: 8

Adequate number of terminals for connecting with other components, providing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

Capable of operating in relatively high-temperature environments, providing reliability under varied conditions.

Minimum Operating Temperature: 0 °C

Can function in low-temperature settings, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for better distribution of electrical connections, enhancing performance.

Maximum Seated Height: 1.75 mm

Low seated height makes the product suitable for slim-profile devices, optimizing space utilization.

Width (mm): 3.9 mm

Narrow width allows for efficient placement on the PCB, ideal for compact electronics.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power management, ensuring efficient energy supply to the connected components.

Minimum Supply Voltage (Vsup): 2.7 V

Wide range of supply voltage options, enabling compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for a specified time, ensuring reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

Capable of withstanding high-temperature reflow processes, ensuring robust assembly.

Length: 4.9 mm

Compact length allows for efficient utilization of space on the PCB, suitable for small electronic devices.

No. of Channels: 2

Multiple channels for power distribution, providing flexibility in managing different power sources.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering on the PCB, ensuring secure electrical connections.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy layout and assembly on the PCB, enhancing manufacturing efficiency.

Maximum Supply Voltage (Vsup): 5.5 V

Wide supply voltage range for compatibility with a variety of electronic devices, offering versatility in application.

Technical Specifications

Power Management ICs TPS2056ADR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2056ADR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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