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TPS2055ADR

Texas Instruments

TPS2055ADR by Texas Instruments

TPS2055ADR by Texas Instruments is a Power Management IC with 8 terminals, operating b/w 0-85°C. It supports supply voltages from 2.7V to 5.5V and has a compact rectangular package ideal for power supply circuits in various applications. The IC features nickel palladium gold terminal finish and gull wing form factor, making it suitable for surface mount designs with a small outline package style.

Median Price

$0.981

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 185,335 parts In-Stock

1+ parts

-

100+ parts

$0.946

1k+ parts

$0.785

10k+ parts

$0.700

185,335

-

$0.946

$0.785

$0.700

DigiKey

USA . 185,335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.180

10k+ parts

-

185,335

-

-

$1.180

-

Verical

USA . 185,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.981

10k+ parts

$0.875

185,101

-

-

$0.981

$0.875

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,671 parts In-Stock

1+ parts

$0.668

100+ parts

-

1k+ parts

-

10k+ parts

-

4,671

$0.668

-

-

-

Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Vyrian

USA . 5,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,172

-

-

-

-

LIBRA Elektronik GmbH

Germany . 99 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

99

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,470 parts In-Stock

1+ parts

$0.633

100+ parts

-

1k+ parts

-

10k+ parts

-

3,470

$0.633

-

-

-

Parana Technologies

USA . 1,156 parts In-Stock

1+ parts

$6.003

100+ parts

-

1k+ parts

$6.779

10k+ parts

-

1,156

$6.003

-

$6.779

-

DigiPath Technology Company

USA . 1,264 parts In-Stock

1+ parts

$6.610

100+ parts

$6.081

1k+ parts

-

10k+ parts

-

1,264

$6.610

$6.081

-

-

ChromeModa Solutions

Germany . 1,213 parts In-Stock

1+ parts

$6.745

100+ parts

$5.531

1k+ parts

-

10k+ parts

-

1,213

$6.745

$5.531

-

-

IDEA Electronic Components Group

UK . 215 parts In-Stock

1+ parts

$6.745

100+ parts

-

1k+ parts

$6.070

10k+ parts

-

215

$6.745

-

$6.070

-

S.R.D Solutions

India . 26,236 parts In-Stock

1+ parts

-

100+ parts

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26,236

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,000

-

-

-

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A-Z Elektronik GmbH

Germany . 4,715 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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4,715

-

-

-

-

Overview

Experience the superior quality and reliability of Texas Instruments with the TPS2055ADR Power Management IC. This versatile component is perfect for a wide range of applications, offering efficient power supply support in a compact package. With its durable plastic/epoxy body and advanced features, this IC ensures optimal performance and longevity. Trust Texas Instruments to deliver cutting-edge technology that meets your power management needs, providing you with the value and benefits you deserve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and reliability, making the product suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Stable 3.3V supply voltage ensures consistent performance and compatibility with a wide range of devices.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the power management IC to other components in the system.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in a variety of environments and conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows the product to function effectively even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish offers good conductivity and corrosion resistance for reliable connections.

Width (mm): 3.9 mm

Compact width enables the power management IC to be used in space-constrained applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically as a power supply support circuit, ensuring efficient power management and distribution.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows the power management IC to support a wide range of input voltages.

Technical Specifications

Power Management ICs TPS2055ADR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2055ADR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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