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TPS2047ADG4

Texas Instruments

TPS2047ADG4 by Texas Instruments

TPS2047ADG4 by Texas Instruments is a Power Management IC with 3 functions, in a small outline package measuring 9.9mm x 3.9mm x 1.75mm. It has 16 terminals with gull wing form and is suitable for power supply support circuits in surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,450 parts In-Stock

1+ parts

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8,450

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Digiode

USA . 1,022 parts In-Stock

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1,022

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 962 parts In-Stock

1+ parts

$4.500

100+ parts

-

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962

$4.500

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Semicontronic

India . 1,423 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

10k+ parts

-

1,423

$6.500

$6.338

$6.305

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One Stop Electronics

USA . 765 parts In-Stock

1+ parts

$6.500

100+ parts

-

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765

$6.500

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Parana Technologies

USA . 41 parts In-Stock

1+ parts

$10.624

100+ parts

-

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$11.116

10k+ parts

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41

$10.624

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$11.116

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DigiPath Technology Company

USA . 1,357 parts In-Stock

1+ parts

$11.698

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1,357

$11.698

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ChromeModa Solutions

Germany . 4,979 parts In-Stock

1+ parts

$11.937

100+ parts

$9.788

1k+ parts

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4,979

$11.937

$9.788

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IDEA Electronic Components Group

UK . 865 parts In-Stock

1+ parts

$11.937

100+ parts

$11.340

1k+ parts

$10.743

10k+ parts

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865

$11.937

$11.340

$10.743

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AZTECH Wire

Italy . 802 parts In-Stock

1+ parts

$14.673

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802

$14.673

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Microchip USA

USA . 272 parts In-Stock

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272

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Corohmni

South Africa . 270 parts In-Stock

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270

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Corphita

USA . 213 parts In-Stock

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213

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Overview

Enhance the efficiency and reliability of your power management systems with the TPS2047ADG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and innovation in their products. The TPS2047ADG4 is a versatile Power Management IC that offers 3 functions in a compact, rectangular package. Whether for automotive, industrial, or consumer electronics applications, this small outline IC provides unmatched value, benefits, and advantages to customers seeking superior performance and functionality. Trust Texas Instruments to power your next project with excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection against environmental factors, making the product long-lasting.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving time and effort during assembly.

No. of Functions: 3

Having 3 functions in one IC reduces the need for multiple components, saving space and simplifying the circuit design.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard PCB layouts, allowing for easy integration into existing designs.

No. of Terminals: 16

With 16 terminals, this IC can support a variety of connections and configurations, enhancing its versatility.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, ideal for applications where board real estate is limited.

Terminal Position: DUAL

Dual terminal position provides flexibility in mounting options, accommodating different PCB layouts and configurations.

Maximum Seated Height: 1.75 mm

Low seated height allows for compact designs and minimal profile, suitable for thin and slim devices.

Width (mm): 3.9 mm

Narrow width enables the IC to fit in tight spaces, making it suitable for applications with limited board area.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC enhances the stability and efficiency of power management systems.

Length: 9.9 mm

Moderate length provides a balance between compactness and easy handling during assembly and maintenance.

Terminal Form: GULL WING

Gull-wing terminal form offers secure soldering connections and easy inspection, ensuring reliable performance.

Terminal Pitch: 1.27 mm

Compact terminal pitch allows for high-density mounting, making it suitable for applications requiring a large number of connections.

Technical Specifications

Power Management ICs TPS2047ADG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

3

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TPS2047ADG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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