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TPS2044DRG4

Texas Instruments

TPS2044DRG4 by Texas Instruments

TPS2044DRG4 by Texas Instruments is a Power Management IC with 4 functions, operating at -40 to 125°C. It supports a supply voltage range of 2.7V to 5.5V and is ideal for industrial applications requiring power supply support circuits in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 9,550 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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9,550

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Vyrian

USA . 5,250 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,250

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Digiode

USA . 1,031 parts In-Stock

1+ parts

-

100+ parts

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1,031

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,435 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,435

$1.500

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-

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$1.874

100+ parts

$1.705

1k+ parts

$1.537

10k+ parts

-

15

$1.874

$1.705

$1.537

-

Semicontronic

India . 477 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

477

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 840 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

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10k+ parts

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840

$5.500

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Parana Technologies

USA . 1,527 parts In-Stock

1+ parts

$13.228

100+ parts

-

1k+ parts

$13.735

10k+ parts

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1,527

$13.228

-

$13.735

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DigiPath Technology Company

USA . 645 parts In-Stock

1+ parts

$14.566

100+ parts

$13.400

1k+ parts

-

10k+ parts

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645

$14.566

$13.400

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ChromeModa Solutions

Germany . 4,616 parts In-Stock

1+ parts

$14.863

100+ parts

$12.188

1k+ parts

-

10k+ parts

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4,616

$14.863

$12.188

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IDEA Electronic Components Group

UK . 1,185 parts In-Stock

1+ parts

$14.863

100+ parts

$14.120

1k+ parts

$13.377

10k+ parts

-

1,185

$14.863

$14.120

$13.377

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AZTECH Wire

Italy . 751 parts In-Stock

1+ parts

$16.866

100+ parts

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1k+ parts

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751

$16.866

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Kepictronics

USA . 8,200 parts In-Stock

1+ parts

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8,200

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Microchip USA

USA . 1,665 parts In-Stock

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1,665

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Corphita

USA . 231 parts In-Stock

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231

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Corohmni

South Africa . 220 parts In-Stock

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220

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Overview

Upgrade your power management game with the TPS2044DRG4 by Texas Instruments. Designed with precision and quality in mind, this Power Management IC offers unmatched reliability and performance. With its versatile applications in various industries, this product is a must-have for anyone looking to streamline their power supply support circuit. Experience the value and benefits that this small outline package has to offer, from its ease of installation to its industrial-grade temperature tolerance. Trust Texas Instruments to deliver exceptional products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good mechanical strength and insulation properties, making the product durable and reliable.

Surface Mount: YES

Surface mount capability allows for easy and compact installation on PCBs, saving space and simplifying the manufacturing process.

No. of Functions: 4

Having multiple functions in one IC reduces the need for additional components, simplifying circuit design and saving costs.

Package Shape: RECTANGULAR

Rectangular shape with small outline makes it easy to integrate the IC into various electronic devices, optimizing space utilization.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a standard voltage level of 3.3 V makes it compatible with a wide range of systems and simplifies power supply requirements.

No. of Terminals: 16

Having a high number of terminals enables efficient connectivity and signal routing, enhancing the overall performance of the IC.

Package Style (Meter): SMALL OUTLINE

Small outline package style offers a compact form factor, ideal for space-constrained applications and reducing overall device size.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance in harsh environments, making the IC suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the IC to function efficiently in extreme cold conditions, enhancing its versatility and reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and long-lasting connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and connection options, allowing for versatile integration in different circuit designs.

Maximum Seated Height: 1.75 mm

Low seated height improves the overall profile of the IC, enabling compact device designs and enhancing aesthetics.

Width (mm): 3.9 mm

Narrow width dimension allows for space-saving installation on the PCB, facilitating efficient use of board space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, the IC enhances the stability and efficiency of power management in electronic devices, ensuring optimal performance.

Minimum Supply Voltage (Vsup): 2.7 V

Operating at a low minimum supply voltage of 2.7 V allows for energy-efficient performance and compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, the IC ensures reliable soldering during the manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper solder joint formation, contributing to the overall durability and longevity of the product.

Length: 9.9 mm

Compact length dimension makes the IC suitable for small form factor applications, enhancing its versatility in diverse electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating indicates the IC's reliability and durability in challenging operating environments, making it suitable for industrial applications.

No. of Channels: 4

Having four channels allows the IC to handle multiple power management tasks simultaneously, improving overall efficiency and functionality.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable soldering connections, ensuring robust electrical contacts for stable performance.

Terminal Pitch: 1.27 mm

Having a standard terminal pitch of 1.27 mm facilitates easy PCB layout and soldering, enhancing the overall manufacturability of the IC.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within a maximum supply voltage of 5.5 V allows the IC to handle a wide range of power inputs, increasing its compatibility with various systems.

Technical Specifications

Power Management ICs TPS2044DRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2044DRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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