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TPS2044ADG4

Texas Instruments

TPS2044ADG4 by Texas Instruments

TPS2044ADG4 by Texas Instruments is a Power Management IC with 16 terminals, operating b/w 0-85°C. It supports a supply voltage range of 2.7V to 5.5V and features four channels in a small outline package, making it ideal for power supply support circuits in various electronic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,109 parts In-Stock

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Digiode

USA . 4,960 parts In-Stock

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4,960

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One Stop Electronics

USA . 656 parts In-Stock

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$1.500

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656

$1.500

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Semicontronic

India . 942 parts In-Stock

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$7.500

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$7.312

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$7.275

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942

$7.500

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$7.275

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AZTECH Wire

Italy . 274 parts In-Stock

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$17.258

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Parana Technologies

USA . 2,005 parts In-Stock

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$18.145

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$18.287

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DigiPath Technology Company

USA . 403 parts In-Stock

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$19.980

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403

$19.980

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ChromeModa Solutions

Germany . 2,233 parts In-Stock

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$20.388

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$16.718

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$20.388

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IDEA Electronic Components Group

UK . 429 parts In-Stock

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$20.388

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$19.369

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$18.349

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Microchip USA

USA . 1,536 parts In-Stock

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Corphita

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Corohmni

South Africa . 206 parts In-Stock

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Overview

Discover the power of Texas Instruments with the TPS2044ADG4 Power Management IC. Designed to provide reliable and efficient power supply support, this small outline package offers 4 channels for versatile applications. With a maximum operating temperature of 85°C and a nominal supply voltage of 3.3V, this IC is perfect for various electronic devices. Trust in Texas Instruments' quality and innovation to enhance your products with this high-performance solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable or compact devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly of the product onto a PCB, saving time and effort in manufacturing.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is commonly used in many electronic devices, ensuring compatibility with a wide range of applications.

No. of Terminals: 16

With 16 terminals, this Power Management IC offers a high level of connectivity and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to withstand harsh environmental conditions, enhancing reliability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures proper functionality even in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of Ni/Pd/Au terminal finish provides excellent conductivity, corrosion resistance, and solderability for robust connections.

Maximum Seated Height: 1.75 mm

The compact maximum seated height of 1.75mm allows for a low-profile design, suitable for space-constrained applications.

Width (mm): 3.9 mm

The narrow width of 3.9mm enables the product to be compact and easily integrated into small electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

The 2.7V minimum supply voltage ensures efficient power management even in low-power applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering during assembly processes.

No. of Channels: 4

Having 4 channels provides the flexibility to control multiple power sources or functions, enhancing versatility in circuit configurations.

Technical Specifications

Power Management ICs TPS2044ADG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TPS2044ADG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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