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TPS2012ADG4

Texas Instruments

TPS2012ADG4 by Texas Instruments

TPS2012ADG4 by Texas Instruments is a Power Management IC with 8 terminals, operating at 3.3V nominal voltage and supporting power supply circuits. It has a small outline package style, can withstand industrial temperatures from -40 to 85°C, and is suitable for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,540 parts In-Stock

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4,540

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Vyrian

USA . 3,526 parts In-Stock

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3,526

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EMSNET

USA . 84 parts In-Stock

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84

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Distributors (Availability)

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Ampacity Inc.

Singapore . 906 parts In-Stock

1+ parts

$0.500

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906

$0.500

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One Stop Electronics

USA . 1,496 parts In-Stock

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$2.500

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1,496

$2.500

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AZTECH Wire

Italy . 348 parts In-Stock

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$6.972

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348

$6.972

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Parana Technologies

USA . 5 parts In-Stock

1+ parts

$8.265

100+ parts

$767.488

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$7.438

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5

$8.265

$767.488

$7.438

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DigiPath Technology Company

USA . 1,330 parts In-Stock

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$9.100

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1,330

$9.100

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ChromeModa Solutions

Germany . 1,098 parts In-Stock

1+ parts

$9.286

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$7.615

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1,098

$9.286

$7.615

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IDEA Electronic Components Group

UK . 706 parts In-Stock

1+ parts

$9.286

100+ parts

$8.822

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$8.357

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706

$9.286

$8.822

$8.357

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Component Stockers USA

USA . 231 parts In-Stock

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$99.990

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Corphita

USA . 2,230 parts In-Stock

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Microchip USA

USA . 1,552 parts In-Stock

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1,552

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Perfect Parts

USA . 252 parts In-Stock

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252

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Overview

Enhance your power management solutions with the TPS2012ADG4 by Texas Instruments. Designed with precision and reliability, this Power Management IC offers unparalleled performance in a compact package. Perfect for industrial applications, this product boasts a wide supply voltage range and dual terminal position for maximum flexibility. Trust in Texas Instruments' reputation for quality and innovation, and experience the value and benefits that the TPS2012ADG4 brings to your projects. Upgrade your power management capabilities today with this advanced and efficient solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Surface Mount: YES

Ease of installation and space-saving benefits for design flexibility.

Nominal Supply Voltage (Vsup): 3.3 V

Suitable for a wide range of applications that require this voltage level.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance for better reliability.

Width (mm): 3.9 mm

Compact size for space-constrained designs.

Minimum Supply Voltage (Vsup): 2.7 V

Allows flexibility in power input options.

Terminal Pitch: 1.27 mm

Standard pitch for easy integration with other components.

Technical Specifications

Power Management ICs TPS2012ADG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

.1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2012ADG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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