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TMX320C6A8168CYG

Texas Instruments

TMX320C6A8168CYG by Texas Instruments

TMX320C6A8168CYG by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at max 27 MHz clock frequency. Suitable for low power applications, it features a 15-bit address bus width and external data bus width of 32 bits. Ideal for use in devices requiring high-speed processing within temperature range of 0-85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,810 parts In-Stock

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Digiode

USA . 1,703 parts In-Stock

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1,703

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Distributors (Availability)

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One Stop Electronics

USA . 1,188 parts In-Stock

1+ parts

$6.000

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1,188

$6.000

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AZTECH Wire

Italy . 564 parts In-Stock

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$9.733

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564

$9.733

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Parana Technologies

USA . 777 parts In-Stock

1+ parts

$54.611

100+ parts

$5,071.487

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$49.150

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777

$54.611

$5,071.487

$49.150

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DigiPath Technology Company

USA . 589 parts In-Stock

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$60.134

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589

$60.134

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ChromeModa Solutions

Germany . 3,094 parts In-Stock

1+ parts

$61.361

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$50.316

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3,094

$61.361

$50.316

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IDEA Electronic Components Group

UK . 1,967 parts In-Stock

1+ parts

$61.361

100+ parts

$58.293

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$55.225

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1,967

$61.361

$58.293

$55.225

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Microchip USA

USA . 2,043 parts In-Stock

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Corphita

USA . 1,378 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMX320C6A8168CYG by Texas Instruments. As a leader in microprocessor innovation, Texas Instruments delivers unmatched quality and reliability. This microprocessor is perfect for a wide range of applications, offering seamless integration and high performance. Unlock endless possibilities with this versatile processor, providing value, benefits, and advantages that exceed expectations. Upgrade your technology experience today with the TMX320C6A8168CYG from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, providing good protection for the microprocessor.

Integrated Cache: YES

Having an integrated cache helps in speeding up data access and improving overall performance of the microprocessor.

Maximum Supply Voltage: 1.05 V

Operating within a suitable voltage range ensures stable performance and longevity of the microprocessor.

Address Bus Width: 15

A wider address bus allows for higher memory addressing capabilities, enabling the microprocessor to handle more data efficiently.

No. of Terminals: 1031

Having a high number of terminals enables various connections and functionalities, making the microprocessor versatile and adaptable.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array package style provides a compact and efficient design, saving space and improving thermal performance of the microprocessor.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Maximum Clock Frequency: 27 MHz

Operating at a high clock frequency allows for faster data processing and better overall performance of the microprocessor.

Technical Specifications

Microprocessors TMX320C6A8168CYG attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

15

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1031

Length:

25 mm

Low Power Mode:

YES

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.31 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMX320C6A8168CYG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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