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TMX320DM8148BCYE

Texas Instruments

TMX320DM8148BCYE by Texas Instruments

TMX320DM8148BCYE by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit address bus width. It operates at a max clock frequency of 30 MHz, suitable for low power applications in various industries like automotive and consumer electronics.

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Lifecycle Status

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6

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1k+

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Vyrian

USA . 5,698 parts In-Stock

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Cyclops Electronics Ltd

UK . 831 parts In-Stock

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Digiode

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Bristol Electronics

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Dan-Mar Components

USA . 364 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 4 parts In-Stock

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One Stop Electronics

USA . 825 parts In-Stock

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AZTECH Wire

Italy . 836 parts In-Stock

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$13.780

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Parana Technologies

USA . 2,227 parts In-Stock

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$30.757

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$69.385

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DigiPath Technology Company

USA . 598 parts In-Stock

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$33.867

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IDEA Electronic Components Group

UK . 1,681 parts In-Stock

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$34.558

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$32.830

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$31.102

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ChromeModa Solutions

Germany . 1,058 parts In-Stock

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Component Stockers USA

USA . 352 parts In-Stock

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Lixinc

USA . 9,625 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,743 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

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Microchip USA

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Kepictronics

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Perfect Parts

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Overview

Experience unparalleled performance and reliability with the TMX320DM8148BCYE by Texas Instruments. As a leader in microprocessor technology, Texas Instruments delivers cutting-edge solutions for a wide range of applications. From robotics to telecommunications, this powerful microprocessor offers seamless integration, advanced features, and exceptional value. Trust Texas Instruments to provide you with the tools you need to take your projects to the next level. Elevate your work with the TMX320DM8148BCYE today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

The integrated cache helps in improving the overall performance of the microprocessor by reducing access times to frequently used data.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures safe operation and efficient power consumption.

Address Bus Width: 16

With a wider address bus width of 16, the microprocessor can handle larger amounts of memory and data for complex tasks.

Bit Size: 32

A 32-bit architecture allows for faster processing and execution of instructions, making the microprocessor suitable for demanding applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable performance even in harsh environmental conditions.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency of 30 MHz enables fast data processing and smooth operation of the microprocessor.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Technical Specifications

Microprocessors TMX320DM8148BCYE attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

684

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA688,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

0.95/1.35

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.37 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMX320DM8148BCYE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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