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TMS3TCI6486BZTZ625

Texas Instruments

TMS3TCI6486BZTZ625 by Texas Instruments

TMS3TCI6486BZTZ625 by Texas Instruments is a 32-bit DSP with 737 terminals, operating at up to 50 MHz. It features a max supply voltage of 1.16 V and is suitable for applications requiring high-speed digital signal processing in various industries.

Median Price

$197.338

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 213 parts In-Stock

1+ parts

$167.950

100+ parts

$157.870

1k+ parts

$147.800

10k+ parts

-

213

$167.950

$157.870

$147.800

-

DigiKey

USA . 213 parts In-Stock

1+ parts

$209.940

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$209.940

-

-

-

Verical

USA . 213 parts In-Stock

1+ parts

-

100+ parts

$197.338

1k+ parts

$184.750

10k+ parts

-

213

-

$197.338

$184.750

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,942 parts In-Stock

1+ parts

$185.269

100+ parts

-

1k+ parts

-

10k+ parts

-

2,942

$185.269

-

-

-

DigiKey Marketplace

USA . 213 parts In-Stock

1+ parts

$202.820

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$202.820

-

-

-

Vyrian

USA . 3,891 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,891

-

-

-

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Prism Electronics

USA . 201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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201

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,009 parts In-Stock

1+ parts

$33.422

100+ parts

-

1k+ parts

$125.194

10k+ parts

-

1,009

$33.422

-

$125.194

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DigiPath Technology Company

USA . 2,337 parts In-Stock

1+ parts

$36.802

100+ parts

-

1k+ parts

-

10k+ parts

-

2,337

$36.802

-

-

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ChromeModa Solutions

Germany . 4,779 parts In-Stock

1+ parts

$37.553

100+ parts

$30.793

1k+ parts

-

10k+ parts

-

4,779

$37.553

$30.793

-

-

IDEA Electronic Components Group

UK . 901 parts In-Stock

1+ parts

$37.553

100+ parts

$35.675

1k+ parts

$33.798

10k+ parts

-

901

$37.553

$35.675

$33.798

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Corohmni

South Africa . 3,222 parts In-Stock

1+ parts

$68.430

100+ parts

-

1k+ parts

-

10k+ parts

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3,222

$68.430

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-

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Corphita

USA . 1,426 parts In-Stock

1+ parts

$175.518

100+ parts

-

1k+ parts

-

10k+ parts

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1,426

$175.518

-

-

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Overview

Elevate your digital signal processing capabilities with the TMS3TCI6486BZTZ625 by Texas Instruments. This high-quality DSP offers unparalleled performance and reliability, making it perfect for a wide range of applications. From audio processing to telecommunications, this versatile product delivers exceptional value and benefits to customers looking for cutting-edge solutions. Trust in Texas Instruments to provide top-of-the-line technology that meets all your DSP needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability, making the product suitable for various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into electronic systems, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.16 V

With a maximum supply voltage of 1.16 V, this product offers low power consumption and efficient operation.

Package Shape: SQUARE

Square package shape facilitates easy placement on circuit boards and ensures a compact design.

Bit Size: 32

The 32-bit processing capability of this DSP ensures high performance and efficient data processing.

Power Supplies (V): 1,1.2,1.8,3.3

Support for multiple power supply voltages enables flexibility in system design and compatibility with various power sources.

No. of Terminals: 737

The large number of terminals allows for versatile connectivity options and interfaces, enhancing the product's functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch package style offer high density integration and precise connections, ideal for advanced electronic systems.

Minimum Supply Voltage: 1.05 V

The low minimum supply voltage of 1.05 V ensures efficient power management and optimal performance under varying conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this DSP can function reliably in a wide range of environments and applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures the product's reliability even in extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal position enables easy and secure mounting on PCBs, ensuring stable connections and efficient signal processing.

Maximum Seated Height: 3.242 mm

The maximum seated height of 3.242 mm allows for low-profile design and compact integration in space-constrained applications.

RAM Words: 8192

With 8192 RAM words, the DSP provides ample memory capacity for storage and retrieval of data, enhancing processing capabilities.

Width: 24 mm

The width of 24 mm offers a compact form factor, making the product suitable for applications with limited space availability.

Boundary Scan: YES

Boundary scan feature allows for easy debugging, testing, and verification of the product, ensuring reliability and functionality.

Maximum Clock Frequency: 50 MHz

With a maximum clock frequency of 50 MHz, this DSP offers high-speed processing and efficient data handling for demanding applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer speed and efficiency, enabling seamless communication within the system.

Length: 24 mm

The length of 24 mm ensures a compact and space-efficient design, suitable for applications where size constraints are a consideration.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances connectivity options and expands the product's functionality in diverse applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance, making the product energy-efficient and cost-effective.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable contact points, ensuring stable performance in challenging operating conditions.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V ensures consistent and reliable power delivery, enhancing the product's performance and longevity.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, the DSP enables precise and compact connections, enhancing signal integrity and efficiency.

Format: FIXED POINT

Fixed-point format allows for efficient and accurate numerical calculations, essential for signal processing and data manipulation tasks.

Low Power Mode: YES

Low power mode functionality offers energy-saving capabilities, extending battery life and reducing overall power consumption for sustainable operation.

Technical Specifications

Digital Signal Processors (DSPs) TMS3TCI6486BZTZ625 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B737

Length:

24 mm

Low Power Mode:

YES

No. of Terminals:

737

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA737,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1,1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS3TCI6486BZTZ625 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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