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TMS32C6416EZLZ7E3

Texas Instruments

TMS32C6416EZLZ7E3 by Texas Instruments

TMS32C6416EZLZ7E3 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, clocked at 75.18 MHz. It operates on supply voltages of 1.36V to 1.44V and features a low power mode, suitable for digital signal processing applications requiring high-speed performance in compact form factors.

Median Price

$176.265

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 168 parts In-Stock

1+ parts

$162.080

100+ parts

$152.360

1k+ parts

$142.630

10k+ parts

-

168

$162.080

$152.360

$142.630

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Verical

USA . 148 parts In-Stock

1+ parts

-

100+ parts

$190.450

1k+ parts

$178.287

10k+ parts

-

148

-

$190.450

$178.287

-

DigiKey

USA . 140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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140

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,808 parts In-Stock

1+ parts

$178.790

100+ parts

-

1k+ parts

-

10k+ parts

-

2,808

$178.790

-

-

-

DigiKey Marketplace

USA . 168 parts In-Stock

1+ parts

$195.730

100+ parts

-

1k+ parts

-

10k+ parts

-

168

$195.730

-

-

-

Vyrian

USA . 5,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,615

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$10.186

100+ parts

$9.269

1k+ parts

$8.353

10k+ parts

-

5,000

$10.186

$9.269

$8.353

-

Parana Technologies

USA . 569 parts In-Stock

1+ parts

$67.736

100+ parts

-

1k+ parts

-

10k+ parts

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569

$67.736

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-

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ChromeModa Solutions

Germany . 5,695 parts In-Stock

1+ parts

$76.108

100+ parts

$62.409

1k+ parts

-

10k+ parts

-

5,695

$76.108

$62.409

-

-

IDEA Electronic Components Group

UK . 201 parts In-Stock

1+ parts

$76.108

100+ parts

$72.303

1k+ parts

$68.497

10k+ parts

-

201

$76.108

$72.303

$68.497

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Corohmni

South Africa . 809 parts In-Stock

1+ parts

$167.800

100+ parts

-

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10k+ parts

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809

$167.800

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Corphita

USA . 1,924 parts In-Stock

1+ parts

$169.380

100+ parts

-

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10k+ parts

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1,924

$169.380

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DigiPath Technology Company

USA . 1,453 parts In-Stock

1+ parts

-

100+ parts

$68.619

1k+ parts

-

10k+ parts

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1,453

-

$68.619

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Microchip USA

USA . 297 parts In-Stock

1+ parts

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100+ parts

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297

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Overview

Experience unparalleled performance and reliability with the Texas Instruments TMS32C6416EZLZ7E3 Digital Signal Processor. As a trusted leader in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. This DSP is perfect for a wide range of applications, offering unmatched value and benefits to customers. Unleash the power of this product and elevate your projects to new heights with ease. Choose Texas Instruments for quality you can trust.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and low cost, making the product sturdy and cost-effective.

Surface Mount : YES

Surface mount components are easier to assemble and allow for a higher component density on the PCB, improving overall efficiency and space utilization.

Maximum Supply Voltage : 1.44 V

A higher maximum supply voltage allows for more flexibility in power supply options and ensures stable performance under varying conditions.

Address Bus Width : 32

A wider address bus width allows for more memory addressing capability and faster data transfer speeds, enhancing the processing power of the DSP.

Package Shape : SQUARE

Square packages are easier to handle and store, optimizing space and providing more uniformity in PCB design.

Bit Size : 32

A 32-bit architecture allows for higher precision in calculations and processing, leading to improved performance and accuracy in signal processing tasks.

Power Supplies (V) : 1.4, 3.3

Having multiple power supply options provides flexibility in system design and allows for efficient power management, ensuring optimal performance.

No. of Terminals : 532

A higher number of terminals allows for more connectivity options and functionalities, making the DSP suitable for complex signal processing applications.

Package Style (Meter) : GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

These package styles offer enhanced thermal performance, mechanical strength, and compatibility with modern PCB designs, improving reliability and overall product quality.

Minimum Supply Voltage : 1.36 V

A low minimum supply voltage ensures efficient power consumption and compatibility with various power sources, extending the operational lifespan of the product.

Terminal Finish : TIN SILVER COPPER

This terminal finish provides excellent solderability, corrosion resistance, and electrical conductivity, ensuring reliable connections and long-term performance.

Terminal Position : BOTTOM

Bottom terminal position simplifies PCB layout and assembly processes, reducing manufacturing costs and enabling easier integration into electronic systems.

Maximum Seated Height : 3.3 mm

A low profile and compact size enable the DSP to fit in constrained spaces, facilitating versatile system integration and minimizing design constraints.

RAM Words : 16384

A large RAM capacity enables the storage of extensive data for processing, enhancing the efficiency and performance of the DSP in handling complex signal processing algorithms.

Width : 23 mm

A moderate width allows for efficient PCB layout and compact system design, making the DSP suitable for applications where space utilization is crucial.

Boundary Scan : YES

Boundary scan capability simplifies testing, debugging, and programming processes, improving overall product quality and reducing time-to-market.

External Data Bus Width : 64

A wide external data bus allows for faster data transfer rates and improved system performance, making the DSP ideal for high-speed signal processing tasks.

Maximum Clock Frequency : 75.18 MHz

A high clock frequency enables rapid data processing and computation, enhancing the real-time performance and responsiveness of the DSP in demanding applications.

Maximum Time At Peak Reflow Temperature (s) : 30

The ability to withstand peak reflow temperatures for a specified period ensures reliable solder connections, preventing thermal damage and ensuring product longevity.

Peak Reflow Temperature °C : 260

The high peak reflow temperature tolerance ensures the DSP's robustness during manufacturing processes, ensuring operational reliability under harsh environmental conditions.

Internal Bus Architecture : MULTIPLE

Multiple internal bus architectures allow for parallel data processing, efficient resource utilization, and improved system performance, enhancing the DSP's processing capabilities.

Length : 23 mm

A compact length facilitates space-efficient PCB layout and system integration, enabling the DSP to be used in a wide range of compact electronic devices.

Peripheral IC Type : DIGITAL SIGNAL PROCESSOR, OTHER

The incorporation of digital signal processor and other peripheral ICs enhances the overall functionality and versatility of the product, making it suitable for diverse applications.

Technology : CMOS

CMOS technology offers low power consumption, high-speed operation, and excellent noise immunity, ensuring efficient performance and reliable operation of the DSP.

Terminal Form : BALL

Ball terminal form simplifies soldering processes and improves electrical connections, enhancing the reliability and durability of the DSP in various operating environments.

Maximum Supply Current : 125 mA

A moderate supply current requirement ensures efficient power usage and compatibility with various power sources, enabling the DSP to be integrated into energy-efficient systems.

Nominal Supply Voltage : 1.4 V

A stable nominal supply voltage ensures consistent performance and reliable operation of the DSP, making it suitable for critical signal processing applications.

Terminal Pitch : 0.8 mm

A fine terminal pitch allows for dense packing of terminals on the PCB, optimizing space utilization and enabling high-performance signal processing in compact electronic devices.

Format : FIXED POINT

Fixed-point arithmetic simplifies signal processing algorithms, improves computational efficiency, and reduces power consumption, making the DSP suitable for real-time applications.

Moisture Sensitivity Level (MSL) : 4

A moisture sensitivity level of 4 indicates the DSP's robustness against moisture-induced damage during handling, storage, and assembly processes, ensuring long-term reliability.

Low Power Mode : YES

The low power mode feature allows the DSP to conserve energy and extend battery life in portable devices, making it an energy-efficient solution for power-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6416EZLZ7E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6416EZLZ7E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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