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TMS32C6416EGLZA6E3

Texas Instruments

TMS32C6416EGLZA6E3 by Texas Instruments

TMS32C6416EGLZA6E3 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.18 MHz. Ideal for industrial applications requiring high-speed signal processing in a compact package with low power mode support.

Median Price

$158.600

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5 parts In-Stock

1+ parts

$158.600

100+ parts

$155.450

1k+ parts

$152.280

10k+ parts

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5

$158.600

$155.450

$152.280

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Distributors (In-Stock)

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Digiode

USA . 4,770 parts In-Stock

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4,770

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Vyrian

USA . 2,043 parts In-Stock

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2,043

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Chip Stock

USA . 345 parts In-Stock

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345

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Nova Conductors

Japan . 70 parts In-Stock

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70

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Distributors (Availability)

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AZTECH Wire

Italy . 883 parts In-Stock

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$18.631

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883

$18.631

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Ampacity Inc.

Singapore . 637 parts In-Stock

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$19.000

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$19.000

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One Stop Electronics

USA . 1,079 parts In-Stock

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$20.000

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1,079

$20.000

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Parana Technologies

USA . 794 parts In-Stock

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$50.386

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794

$50.386

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DigiPath Technology Company

USA . 1,669 parts In-Stock

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$55.481

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$51.042

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1,669

$55.481

$51.042

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IDEA Electronic Components Group

UK . 1,918 parts In-Stock

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$56.613

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$53.782

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$50.952

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1,918

$56.613

$53.782

$50.952

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ChromeModa Solutions

Germany . 577 parts In-Stock

1+ parts

$56.613

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$46.423

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577

$56.613

$46.423

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Microchip USA

USA . 2,215 parts In-Stock

1+ parts

$197.070

100+ parts

$191.820

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$189.190

10k+ parts

$186.560

2,215

$197.070

$191.820

$189.190

$186.560

Corohmni

South Africa . 299 parts In-Stock

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$201.418

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Lixinc

USA . 8,308 parts In-Stock

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Kepictronics

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6,000

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Corphita

USA . 4,187 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 336 parts In-Stock

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336

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Overview

Unlock unparalleled performance and efficiency with the TMS32C6416EGLZA6E3 by Texas Instruments, a cutting-edge digital signal processor designed to revolutionize your applications. With Texas Instruments' reputation for quality and innovation backing it, this DSP offers unmatched value and benefits. From industrial automation to telecommunications, this versatile processor delivers the power and reliability you need to stay ahead of the competition. Say goodbye to limitations and hello to endless possibilities with the TMS32C6416EGLZA6E3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for various environments.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the DSP.

Surface Mount: YES

Surface mounting allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 1.44 V

The higher maximum supply voltage allows for flexibility in power supply options.

Address Bus Width: 32

A wider address bus allows for more memory addressing capabilities and faster data transfer.

Package Shape: SQUARE

The square shape provides uniformity and ease of mounting on PCBs.

Bit Size: 32

A 32-bit processing capability enables higher performance and data handling.

Power Supplies (V): 1.4, 3.3

Multiple power supply options allow for flexibility in power management and energy efficiency.

No. of Terminals: 532

Having a large number of terminals enables connectivity with multiple I/O devices and peripherals.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

The package style options provide versatility for different mounting and cooling requirements.

Minimum Supply Voltage: 1.36 V

The lower minimum supply voltage ensures the DSP can operate efficiently even at lower power levels.

Maximum Operating Temperature: 105 °C

The high operating temperature range makes the DSP suitable for industrial applications where temperature variations are common.

No. of External Interrupts: 4

Having multiple external interrupts allows for efficient handling of real-time events and communication with external devices.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the DSP can function reliably even in extreme cold conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and robust connection with PCBs.

Terminal Position: BOTTOM

The bottom terminal position makes it easy for PCB assembly and connection with other components.

Maximum Seated Height: 3.3 mm

The low seated height allows for compact designs and space-saving in electronic devices.

RAM Words: 16384

Having a large RAM capacity enables efficient data storage and processing for complex algorithms and applications.

Width: 23 mm

The compact width allows for flexibility in PCB layout and space-constrained designs.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the DSP during manufacturing and maintenance.

External Data Bus Width: 64

A wider external data bus width enables faster data transfer and processing capabilities.

Maximum Clock Frequency: 75.18 MHz

The high clock frequency allows for quick data processing and real-time operation of the DSP.

Peak Reflow Temperature °C: 220

The high peak reflow temperature ensures robust solder connections during manufacturing processes.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enables efficient data flow and processing within the DSP.

Length: 23 mm

The compact length allows for space-saving and versatile integration in various electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments and industrial settings.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type indicates the DSP's capabilities in processing digital signals and handling various peripherals.

No. of Timers: 3

Multiple timers allow for efficient timing and scheduling of tasks within the DSP.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation of the DSP.

Terminal Form: BALL

The ball terminal form facilitates efficient soldering and connection with PCB pads.

Maximum Supply Current: 125 mA

The low maximum supply current indicates energy efficiency and low power consumption of the DSP.

Nominal Supply Voltage: 1.4 V

The nominal supply voltage provides a standard operating voltage for the DSP.

No. of DMA Channels: 64

Having multiple DMA channels allows for efficient data transfer and processing without CPU intervention.

Terminal Pitch: 0.8 mm

The fine terminal pitch enables compact and space-saving designs on PCBs.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations and enhances processing speed in the DSP.

Moisture Sensitivity Level (MSL): 4

The MSL level indicates the DSP's susceptibility to moisture during storage and handling, ensuring proper precautions are taken.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation and extended battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6416EGLZA6E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6416EGLZA6E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-660-4127, 5962016604127

NIIN

016604127

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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