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TMS32C6416EGLZA5E0

Texas Instruments

TMS32C6416EGLZA5E0 by Texas Instruments

TMS32C6416EGLZA5E0 by Texas Instruments is a 32-bit DSP with integrated cache, operating at a max clock frequency of 75.18 MHz. Ideal for industrial applications, it features a 64-bit external data bus width and low power mode for efficient performance. With a package style including grid array and heat sink/slug, this DSP offers advanced signal processing capabilities in a compact form factor.

Median Price

$132.170

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,386 parts In-Stock

1+ parts

$132.170

100+ parts

$129.540

1k+ parts

$126.890

10k+ parts

-

1,386

$132.170

$129.540

$126.890

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,138

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-

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Digiode

USA . 974 parts In-Stock

1+ parts

-

100+ parts

-

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974

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 355 parts In-Stock

1+ parts

$13.938

100+ parts

-

1k+ parts

-

10k+ parts

-

355

$13.938

-

-

-

One Stop Electronics

USA . 1,571 parts In-Stock

1+ parts

$17.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,571

$17.000

-

-

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Ampacity Inc.

Singapore . 597 parts In-Stock

1+ parts

$27.000

100+ parts

-

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-

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597

$27.000

-

-

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Parana Technologies

USA . 410 parts In-Stock

1+ parts

$76.885

100+ parts

-

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-

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410

$76.885

-

-

-

DigiPath Technology Company

USA . 1,187 parts In-Stock

1+ parts

$84.660

100+ parts

$77.887

1k+ parts

-

10k+ parts

-

1,187

$84.660

$77.887

-

-

ChromeModa Solutions

Germany . 4,529 parts In-Stock

1+ parts

$86.388

100+ parts

$70.838

1k+ parts

-

10k+ parts

-

4,529

$86.388

$70.838

-

-

IDEA Electronic Components Group

UK . 1,350 parts In-Stock

1+ parts

$86.388

100+ parts

$82.069

1k+ parts

$77.749

10k+ parts

-

1,350

$86.388

$82.069

$77.749

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Component Stockers USA

USA . 360 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

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360

$99.990

-

-

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Microchip USA

USA . 2,960 parts In-Stock

1+ parts

$158.620

100+ parts

$154.390

1k+ parts

$152.270

10k+ parts

$150.160

2,960

$158.620

$154.390

$152.270

$150.160

Corohmni

South Africa . 701 parts In-Stock

1+ parts

$160.557

100+ parts

-

1k+ parts

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701

$160.557

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Corphita

USA . 3,271 parts In-Stock

1+ parts

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3,271

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Perfect Parts

USA . 134 parts In-Stock

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134

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Overview

Experience unparalleled performance and efficiency with the TMS32C6416EGLZA5E0 by Texas Instruments, a leader in digital signal processors. Ideal for a wide range of applications, this cutting-edge DSP offers integrated cache, multiple power supplies, and boundary scan capabilities. With a maximum clock frequency of 75.18 MHz and 532 terminals, this product delivers exceptional value and benefits to customers seeking reliable and high-quality solutions. Upgrade your projects with the TMS32C6416EGLZA5E0 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the digital signal processor, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

Having an integrated cache allows for faster data access and processing, improving overall performance of the DSP.

Maximum Supply Voltage: 1.31 V

The higher maximum supply voltage allows for flexibility in power supply options while ensuring safe operation of the DSP.

Address Bus Width: 32

A wider address bus allows for greater memory addressing capabilities, enabling the DSP to handle more complex algorithms and data manipulation.

Surface Mount: YES

Being surface mountable makes installation and integration of the DSP easier in various electronic devices, saving space and reducing assembly time.

RAM Words: 16384

The large RAM capacity enables the DSP to store and manipulate a significant amount of data, facilitating efficient signal processing tasks.

Maximum Clock Frequency: 75.18 MHz

The high clock frequency allows for swift operation and processing speed, critical for real-time signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable for demanding applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6416EGLZA5E0 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

1.31 V

Minimum Supply Voltage:

1.19 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6416EGLZA5E0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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