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TMS32C6416DGLZ7E3

Texas Instruments

TMS32C6416DGLZ7E3 by Texas Instruments

TMS32C6416DGLZ7E3 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and max clock frequency of 75.19 MHz. Ideal for digital signal processing applications requiring low power mode, it features CMOS technology and fixed-point format for efficient processing.

Median Price

$193.552

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 215 parts In-Stock

1+ parts

$177.980

100+ parts

$167.300

1k+ parts

$156.620

10k+ parts

-

215

$177.980

$167.300

$156.620

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DigiKey

USA . 215 parts In-Stock

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-

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215

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Verical

USA . 199 parts In-Stock

1+ parts

-

100+ parts

$209.125

1k+ parts

$195.775

10k+ parts

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199

-

$209.125

$195.775

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,594 parts In-Stock

1+ parts

$196.318

100+ parts

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4,594

$196.318

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Vyrian

USA . 5,035 parts In-Stock

1+ parts

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5,035

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DigiKey Marketplace

USA . 215 parts In-Stock

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215

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Tectiva GmbH

Germany . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,556 parts In-Stock

1+ parts

$50.250

100+ parts

-

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1,556

$50.250

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DigiPath Technology Company

USA . 1,495 parts In-Stock

1+ parts

$55.332

100+ parts

$50.905

1k+ parts

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1,495

$55.332

$50.905

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IDEA Electronic Components Group

UK . 810 parts In-Stock

1+ parts

$56.461

100+ parts

$53.638

1k+ parts

$50.815

10k+ parts

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810

$56.461

$53.638

$50.815

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ChromeModa Solutions

Germany . 780 parts In-Stock

1+ parts

$56.461

100+ parts

$46.298

1k+ parts

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780

$56.461

$46.298

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Corohmni

South Africa . 20 parts In-Stock

1+ parts

$69.405

100+ parts

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20

$69.405

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Ampacity Inc.

Singapore . 67 parts In-Stock

1+ parts

$175.650

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67

$175.650

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Corphita

USA . 518 parts In-Stock

1+ parts

$185.985

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518

$185.985

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Microchip USA

USA . 236 parts In-Stock

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236

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Overview

Experience exceptional performance with the TMS32C6416DGLZ7E3 by Texas Instruments, a leading manufacturer in the digital signal processor category. This powerful DSP offers unparalleled value with its advanced technology and versatile applications. Whether you're looking to enhance audio quality, improve image processing, or optimize communication systems, this product delivers superior functionality with maximum efficiency. Trust Texas Instruments for reliable solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.44 V

The high maximum supply voltage ensures stable operation and allows for flexibility in power supply design.

Address Bus Width: 23

A wide address bus width of 23 bits enables efficient memory addressing and access, improving overall performance.

Package Shape: SQUARE

The square package shape provides a compact form factor, maximizing space efficiency on the PCB.

Bit Size: 32

A 32-bit architecture allows for high-speed processing and complex calculations, making the product suitable for demanding applications.

Power Supplies (V): 1.4,3.3

Support for multiple power supply voltages (1.4V and 3.3V) provides flexibility in system design and compatibility with different power sources.

No. of Terminals: 532

The high number of terminals allows for seamless connection to other components, peripherals, and interfaces, enhancing the product's versatility.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style ensures secure mounting and reliable connections, suitable for high-density PCB layouts.

Minimum Supply Voltage: 1.36 V

The low minimum supply voltage ensures energy efficiency and helps prolong battery life in portable devices.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability and conductivity, ensuring reliable connections and reducing the risk of solder joints failure.

Terminal Position: BOTTOM

Bottom terminal positions offer easy accessibility for soldering and inspection during assembly, simplifying the manufacturing process.

Maximum Seated Height: 3.3 mm

The maximum seated height of 3.3mm allows for a low-profile design, suitable for space-constrained applications.

RAM Words: 16384

A large RAM capacity of 16384 words enables efficient data storage and retrieval, enhancing the product's processing capabilities.

Width: 23 mm

The compact width of 23mm makes the product suitable for small form factor designs and space-limited applications.

Boundary Scan: YES

Boundary scan capability allows for easy testing and debugging of the product, improving reliability and reducing maintenance costs.

External Data Bus Width: 64

A wide external data bus width of 64 bits enables high-speed data transfer and efficient communication with external devices, enhancing performance.

Maximum Clock Frequency: 75.19 MHz

The high maximum clock frequency of 75.19 MHz allows for fast processing speed and real-time operation, suitable for demanding applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture improves data throughput and parallel processing capabilities, making the product efficient for complex operations.

Length: 23 mm

The compact length of 23mm complements the product's square shape, ensuring a space-efficient design on the PCB.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of digital signal processor peripheral IC types enhances the product's signal processing capabilities and versatility for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

The ball terminal form provides excellent electrical conductivity and thermal performance, ensuring reliable connections and smooth operation.

Nominal Supply Voltage: 1.4 V

The nominal supply voltage of 1.4V ensures stable and reliable operation, meeting the product's power requirements.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm allows for high-density mounting and efficient use of PCB space, ideal for compact designs.

Format: FIXED POINT

The fixed-point format offers predictable and consistent arithmetic operations, suitable for applications requiring precision and accuracy in calculations.

Moisture Sensitivity Level (MSL): 4

A moisture sensitivity level of 4 indicates the product can withstand moderately humid environments, ensuring reliability in various operating conditions.

Low Power Mode: YES

The availability of a low power mode allows for energy-efficient operation and extended battery life, making the product suitable for portable and battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6416DGLZ7E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6416DGLZ7E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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