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TMS32C6415EGLZ5E0

Texas Instruments

TMS32C6415EGLZ5E0 by Texas Instruments

TMS32C6415EGLZ5E0 by Texas Instruments is a 32-bit DSP with integrated cache and 64-bit external data bus width. Ideal for digital signal processing applications, it operates at a max clock frequency of 75.18 MHz and features low power mode for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,056 parts In-Stock

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4,056

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Digiode

USA . 3,830 parts In-Stock

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3,830

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Bristol Electronics

USA . 1,321 parts In-Stock

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1,321

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 715 parts In-Stock

1+ parts

$7.603

100+ parts

-

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715

$7.603

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One Stop Electronics

USA . 1,088 parts In-Stock

1+ parts

$11.000

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-

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1,088

$11.000

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Ampacity Inc.

Singapore . 895 parts In-Stock

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$15.000

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895

$15.000

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Corohmni

South Africa . 2,928 parts In-Stock

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$46.649

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2,928

$46.649

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Parana Technologies

USA . 1,313 parts In-Stock

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$75.597

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1,313

$75.597

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DigiPath Technology Company

USA . 2,005 parts In-Stock

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$83.242

100+ parts

$76.583

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2,005

$83.242

$76.583

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ChromeModa Solutions

Germany . 5,189 parts In-Stock

1+ parts

$84.941

100+ parts

$69.652

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5,189

$84.941

$69.652

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IDEA Electronic Components Group

UK . 1,733 parts In-Stock

1+ parts

$84.941

100+ parts

$80.694

1k+ parts

$76.447

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1,733

$84.941

$80.694

$76.447

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Microchip USA

USA . 2,385 parts In-Stock

1+ parts

$124.380

100+ parts

$121.060

1k+ parts

$119.410

10k+ parts

$117.750

2,385

$124.380

$121.060

$119.410

$117.750

QUARKTWIN TECHNOLOGY LTD

USA . 22,503 parts In-Stock

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Corphita

USA . 2,346 parts In-Stock

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ChipTracer

USA . 1,321 parts In-Stock

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1,321

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Metaverse IC Inc.

Canada . 1,000 parts In-Stock

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1,000

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Overview

Unlock unparalleled performance and efficiency with the TMS32C6415EGLZ5E0 from Texas Instruments, a leading manufacturer in digital signal processors. This cutting-edge DSP offers integrated cache, low power mode, and a wide range of applications in industries such as telecommunications, audio processing, and industrial automation. Experience the value of seamless operation and top-notch quality with this versatile product that delivers superior results every time. Elevate your projects with the TMS32C6415EGLZ5E0 and discover a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that is ideal for portable and rugged applications.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.26 V

Efficient power usage with a relatively low maximum supply voltage.

Address Bus Width: 32

Allows for access to a larger memory space for complex processing tasks.

Bit Size: 32

Higher bit size enables more precision in calculations and data processing.

No. of Terminals: 532

Provides ample connectivity options for various peripherals and external devices.

Maximum Clock Frequency: 75.18 MHz

High clock frequency for fast data processing and response times.

Internal Bus Architecture: MULTIPLE

Efficient data transfer between internal components for seamless operation.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile functionality for handling digital signal processing tasks along with other peripheral functions.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Low Power Mode: YES

Enables energy-efficient operation to prolong battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6415EGLZ5E0 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6415EGLZ5E0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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