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TMS32C6415DGLZ6E3

Texas Instruments

TMS32C6415DGLZ6E3 by Texas Instruments

TMS32C6415DGLZ6E3 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and max clock frequency of 75.75 MHz. Ideal for digital signal processing applications requiring low power mode, it features a grid array package style with 532 terminals and operates on supply voltages ranging from 1.36V to 3.3V.

Median Price

$65.040

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$65.040

1k+ parts

$58.190

10k+ parts

$54.770

20

-

$65.040

$58.190

$54.770

DigiKey

USA . 20 parts In-Stock

1+ parts

-

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20

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 6 parts In-Stock

1+ parts

$58.690

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-

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6

$58.690

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Digiode

USA . 3,966 parts In-Stock

1+ parts

$68.647

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3,966

$68.647

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DigiKey Marketplace

USA . 20 parts In-Stock

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$75.150

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20

$75.150

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Vyrian

USA . 6,619 parts In-Stock

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6,619

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ACDS - Activité Composants Distribution Service

France . 6 parts In-Stock

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Bristol Electronics

USA . 6 parts In-Stock

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Dan-Mar Components

USA . 6 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 4,878 parts In-Stock

1+ parts

$37.328

100+ parts

-

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4,878

$37.328

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Parana Technologies

USA . 2,110 parts In-Stock

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$43.641

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$43.641

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DigiPath Technology Company

USA . 1,298 parts In-Stock

1+ parts

$48.054

100+ parts

$44.210

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1,298

$48.054

$44.210

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ChromeModa Solutions

Germany . 6,563 parts In-Stock

1+ parts

$49.035

100+ parts

$40.209

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6,563

$49.035

$40.209

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IDEA Electronic Components Group

UK . 455 parts In-Stock

1+ parts

$49.035

100+ parts

$46.583

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$44.132

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455

$49.035

$46.583

$44.132

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Component Stockers USA

USA . 28 parts In-Stock

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$56.470

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$56.470

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Corphita

USA . 2,916 parts In-Stock

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$65.034

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2,916

$65.034

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Microchip USA

USA . 159 parts In-Stock

1+ parts

$159.550

100+ parts

$156.780

1k+ parts

$155.390

10k+ parts

$154.000

159

$159.550

$156.780

$155.390

$154.000

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Overview

Unlock the power of cutting-edge technology with the TMS32C6415DGLZ6E3 by Texas Instruments. As a leading manufacturer in the digital signal processor category, Texas Instruments delivers top-quality products that guarantee superior performance and reliability. Perfect for a wide range of applications, this DSP offers unmatched value with its high-speed processing capabilities and low power consumption. Experience seamless operation and enhanced efficiency with the TMS32C6415DGLZ6E3, your ultimate solution for all your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.44 V

Allows for compatibility with a wide range of power sources, increasing flexibility in usage scenarios.

Address Bus Width: 23

Provides sufficient address space for handling complex data processing tasks efficiently.

Package Shape: SQUARE

Optimizes space utilization on the circuit board, allowing for compact and tidy designs.

Bit Size: 32

Enables high-speed data processing and computational capabilities, suitable for demanding applications.

Power Supplies (V): 1.4,3.3

Supports different power requirements, allowing for versatile usage in various systems.

No. of Terminals: 532

Offers ample connection points for interfacing with other components, facilitating seamless integration in complex systems.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enhances signal transmission efficiency and reliability, crucial for high-performance signal processing tasks.

Minimum Supply Voltage: 1.36 V

Ensures stable operation even under low power conditions, improving the product's reliability.

Terminal Finish: TIN LEAD

Provides good solderability and conductivity, ensuring reliable electrical connections for optimal performance.

Terminal Position: BOTTOM

Facilitates easy mounting and maintenance, enhancing usability and accessibility in the product design.

Maximum Seated Height: 3.3 mm

Allows for compatibility with slim and compact device designs, enhancing flexibility in product applications.

RAM Words: 16384

Provides sufficient memory capacity for storing and manipulating data efficiently, crucial for processing-intensive tasks.

Width: 23 mm

Compact dimensions enable the product to fit into space-constrained environments, ideal for embedded systems.

Boundary Scan: YES

Facilitates efficient testing and debugging of the product during the manufacturing process, ensuring quality control.

External Data Bus Width: 64

Enables high-speed data transfer between the processor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 75.75 MHz

Supports high-speed processing capabilities, ideal for real-time signal processing applications.

Internal Bus Architecture: MULTIPLE

Allows for parallel data processing and efficient communication between internal components, improving overall performance.

Length: 23 mm

Compact form factor enables easy integration into various product designs, enhancing versatility.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports a wide range of peripheral devices, expanding the product's connectivity options for diverse applications.

Technology: CMOS

Provides low power consumption and high noise immunity, making the product energy-efficient and robust against interference.

Terminal Form: BALL

Facilitates secure soldering connections and reliable signal transmission, ensuring stable operation in demanding environments.

Nominal Supply Voltage: 1.4 V

Optimal voltage level for efficient performance and reliability, ensuring consistent operation under varying conditions.

Terminal Pitch: 0.8 mm

Provides fine pitch spacing for compact designs, allowing for high-density mounting and space-saving in product layouts.

Format: FIXED POINT

Enables precise mathematical calculations and accurate data processing, essential for high-fidelity signal processing applications.

Moisture Sensitivity Level (MSL): 4

Indicates the level of protection against moisture damage, crucial for ensuring product durability and reliability in various environments.

Low Power Mode: YES

Allows for energy-efficient operation, prolonging battery life and reducing power consumption in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6415DGLZ6E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6415DGLZ6E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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