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TMS32C6414DGLZ7E3

Texas Instruments

TMS32C6414DGLZ7E3 by Texas Instruments

TMS32C6414DGLZ7E3 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, clocked at 75.18 MHz. It operates on power supplies of 1.4V and 3.3V, featuring a RAM of 16384 words for digital signal processing applications requiring high-speed computations in compact form factors.

Median Price

$92.586

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24 parts In-Stock

1+ parts

-

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$80.310

1k+ parts

$71.860

10k+ parts

$67.630

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$71.860

$67.630

DigiKey

USA . 24 parts In-Stock

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Verical

USA . 24 parts In-Stock

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$104.862

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$94.813

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24

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$104.862

$94.813

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Distributors (In-Stock)

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NAC Semi

USA . 27 parts In-Stock

1+ parts

$71.280

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$71.280

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Digiode

USA . 697 parts In-Stock

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$84.778

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DigiKey Marketplace

USA . 24 parts In-Stock

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$92.810

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$92.810

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Vyrian

USA . 8,174 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,173 parts In-Stock

1+ parts

$31.991

100+ parts

-

1k+ parts

$94.152

10k+ parts

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1,173

$31.991

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$94.152

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DigiPath Technology Company

USA . 2,358 parts In-Stock

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$35.226

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$32.408

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$35.226

$32.408

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IDEA Electronic Components Group

UK . 1,782 parts In-Stock

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$35.945

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$34.148

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$32.350

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1,782

$35.945

$34.148

$32.350

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ChromeModa Solutions

Germany . 1,179 parts In-Stock

1+ parts

$35.945

100+ parts

$29.475

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$35.945

$29.475

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Corphita

USA . 2,832 parts In-Stock

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$80.316

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Corohmni

South Africa . 1,059 parts In-Stock

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$80.648

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1,059

$80.648

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Microchip USA

USA . 110 parts In-Stock

1+ parts

$137.910

100+ parts

$135.510

1k+ parts

$134.310

10k+ parts

$133.120

110

$137.910

$135.510

$134.310

$133.120

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 820 parts In-Stock

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Emar International I/E

Canada . 155 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS32C6414DGLZ7E3 by Texas Instruments. As a leader in the industry, Texas Instruments delivers unmatched quality and reliability in their Digital Signal Processors (DSPs). This versatile processor is perfect for a wide range of applications, offering customers unparalleled performance and efficiency. Experience seamless operation and exceptional results with the TMS32C6414DGLZ7E3, a product that truly stands out from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the DSP, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.44 V

Operating at a maximum supply voltage of 1.44V ensures stable performance and protects the DSP from potential damage due to overvoltage.

Address Bus Width: 32

Having a wide address bus width of 32 facilitates efficient data transfer and processing capabilities, enhancing the overall performance of the DSP.

Package Shape: SQUARE

The square package shape allows for compact and space-saving design integration, making it suitable for compact electronic devices.

Bit Size: 32

With a bit size of 32, the DSP can handle complex calculations and data processing tasks effectively, providing high computational power.

Power Supplies (V): 1.4, 3.3

Support for multiple power supply voltages (1.4V and 3.3V) offers flexibility in design and compatibility with different power sources.

No. of Terminals: 532

A large number of terminals (532) enable connectivity with various external components and peripherals, expanding the functionality of the DSP.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

The package style options (Grid Array, Heat Sink/Slug, Fine Pitch) provide versatility in mounting and cooling solutions, enhancing performance and thermal management.

Minimum Supply Voltage: 1.36 V

The minimum supply voltage of 1.36V ensures reliable operation even under low power conditions, improving energy efficiency and power management.

Terminal Finish: TIN LEAD

The Tin Lead terminal finish offers good solderability and corrosion resistance, ensuring strong and reliable electrical connections for the DSP.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting on PCBs, providing a stable and reliable connection interface.

Maximum Seated Height: 3.3 mm

With a maximum seated height of 3.3mm, the DSP can be efficiently integrated into slim and compact devices without compromising on performance or functionality.

RAM Words: 16384

A high RAM word count of 16384 enables the DSP to store and access a large amount of data quickly, enhancing processing speed and efficiency.

Width: 23 mm

A compact width of 23mm allows for easy integration into various electronic designs, making it suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during production and maintenance processes, ensuring optimal performance and reliability.

External Data Bus Width: 64

With an external data bus width of 64, the DSP can handle large data transfers efficiently, improving overall system throughput and performance.

Maximum Clock Frequency: 75.18 MHz

A high maximum clock frequency of 75.18 MHz allows the DSP to process data at a fast rate, enabling real-time signal processing and high-speed computations.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and communication within the DSP, improving efficiency and reducing latency for complex processing tasks.

Length: 23 mm

A compact length of 23mm allows for space-efficient integration into electronic designs, making it suitable for miniaturized and portable devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types, including digital signal processors and others, offers compatibility with a wide range of external components and devices, enhancing versatility and connectivity.

Technology: CMOS

Using CMOS technology enables low power consumption and high-speed operation, making the DSP energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, ensuring stable electrical contact and signal transmission for optimal performance.

Nominal Supply Voltage: 1.4 V

Operating at a nominal supply voltage of 1.4V ensures stable and consistent performance, meeting the power requirements of the DSP for reliable operation.

Terminal Pitch: 0.8 mm

A slim terminal pitch of 0.8mm allows for dense packing and efficient use of board space, making the DSP suitable for compact and high-density designs.

Format: FIXED POINT

Utilizing a fixed-point format simplifies arithmetic operations and enhances computational efficiency, making the DSP suitable for real-time calculations and signal processing tasks.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, the DSP can withstand exposure to moderate levels of moisture during handling and operation, ensuring reliability in various environmental conditions.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and extends battery life, making the DSP suitable for power-sensitive applications and portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6414DGLZ7E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6414DGLZ7E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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