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TMS320VC5510GGWA1

Texas Instruments

TMS320VC5510GGWA1 by Texas Instruments

TMS320VC5510GGWA1 by Texas Instruments is a 16-bit DSP with 32-bit external data bus, operating at max 50 MHz. Ideal for industrial applications, it features 32768 RAM words, low power mode, and boundary scan capability.

Median Price

$17.087

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 97 parts In-Stock

1+ parts

-

100+ parts

$13.670

1k+ parts

$12.230

10k+ parts

$11.510

97

-

$13.670

$12.230

$11.510

DigiKey

USA . 97 parts In-Stock

1+ parts

-

100+ parts

$17.990

1k+ parts

-

10k+ parts

-

97

-

$17.990

-

-

Verical

USA . 41 parts In-Stock

1+ parts

-

100+ parts

$17.087

1k+ parts

$15.287

10k+ parts

$14.387

41

-

$17.087

$15.287

$14.387

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,658 parts In-Stock

1+ parts

$14.440

100+ parts

-

1k+ parts

-

10k+ parts

-

4,658

$14.440

-

-

-

Vyrian

USA . 7,156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,156

-

-

-

-

DigiKey Marketplace

USA . 97 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

97

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,499 parts In-Stock

1+ parts

$13.680

100+ parts

-

1k+ parts

-

10k+ parts

-

1,499

$13.680

-

-

-

Component Stockers USA

USA . 144 parts In-Stock

1+ parts

$15.330

100+ parts

-

1k+ parts

-

10k+ parts

-

144

$15.330

-

-

-

Microchip USA

USA . 1,096 parts In-Stock

1+ parts

$40.850

100+ parts

$40.270

1k+ parts

$39.980

10k+ parts

$39.680

1,096

$40.850

$40.270

$39.980

$39.680

Parana Technologies

USA . 1,693 parts In-Stock

1+ parts

$44.027

100+ parts

-

1k+ parts

-

10k+ parts

-

1,693

$44.027

-

-

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DigiPath Technology Company

USA . 2,277 parts In-Stock

1+ parts

$48.480

100+ parts

-

1k+ parts

-

10k+ parts

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2,277

$48.480

-

-

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ChromeModa Solutions

Germany . 4,159 parts In-Stock

1+ parts

$49.469

100+ parts

$40.565

1k+ parts

-

10k+ parts

-

4,159

$49.469

$40.565

-

-

IDEA Electronic Components Group

UK . 1,615 parts In-Stock

1+ parts

$49.469

100+ parts

$46.996

1k+ parts

$44.522

10k+ parts

-

1,615

$49.469

$46.996

$44.522

-

Corohmni

South Africa . 3,154 parts In-Stock

1+ parts

$61.044

100+ parts

-

1k+ parts

-

10k+ parts

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3,154

$61.044

-

-

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Overview

Unleash the power of digital signal processing with the TMS320VC5510GGWA1 by Texas Instruments. Known for their top-quality products, Texas Instruments offers a cutting-edge solution in the form of this DSP. Ideal for a variety of applications, this DSP provides customers with unparalleled value and benefits. Experience enhanced performance, efficiency, and reliability with the TMS320VC5510GGWA1, making it a must-have for anyone looking to take their projects to the next level. Step into the future of technology with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP, making it suitable for a variety of environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy installation and integration of the DSP into different electronic devices, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.65 V

Operating within a low maximum supply voltage range makes this DSP energy-efficient and helps in reducing power consumption.

Address Bus Width: 22

A wider address bus allows for efficient and fast data processing, enabling the DSP to handle complex algorithms and calculations effectively.

Package Shape: SQUARE

The square package shape provides uniformity in size and allows for easy handling and assembly of the DSP in electronic circuits.

Bit Size: 16

A 16-bit architecture allows the DSP to process data accurately and quickly, making it suitable for tasks that require high computational power.

Power Supplies (V): 1.6,3.3

The availability of multiple power supply options makes this DSP versatile and compatible with various voltage requirements in different applications.

No. of Terminals: 240

Having a high number of terminals enables efficient connectivity and communication between the DSP and other components in a system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances the overall performance and reliability of the DSP and allows for dense packaging in compact devices.

Minimum Supply Voltage: 1.55 V

Operating at a low minimum supply voltage ensures that the DSP can function effectively even under low power conditions, making it energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this DSP can withstand elevated temperatures without compromising its performance, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures allows this DSP to function reliably in cold environments, expanding its usability in diverse conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures good solderability and conductivity, facilitating the installation and robust connection of the DSP in electronic assemblies.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the mounting process of the DSP, enabling efficient heat dissipation and ensuring proper signal routing.

Maximum Seated Height: 1.4 mm

A low maximum seated height allows for compact and slim device designs, making this DSP suitable for applications with space constraints.

RAM Words: 32768

With a large RAM capacity, this DSP can store and retrieve a significant amount of data quickly, enhancing its processing capabilities and efficiency.

Width: 15 mm

Compact dimensions in width make this DSP ideal for integration into small electronic devices and systems, without compromising on performance.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during the manufacturing process, ensuring high product quality and reliability.

External Data Bus Width: 32

A wider external data bus allows for faster data transfer between the DSP and external devices, enhancing the overall processing speed and efficiency.

Maximum Clock Frequency: 50 MHz

Operating at a high maximum clock frequency, this DSP can perform tasks rapidly and accurately, making it suitable for real-time signal processing applications.

Internal Bus Architecture: MULTIPLE

Multiple internal buses allow for parallel processing of data within the DSP, improving efficiency, speed, and overall performance in complex computing tasks.

Length: 15 mm

Compact dimensions in length enable easy integration and placement of the DSP in electronic devices, contributing to space-saving and streamlined product designs.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this DSP can operate reliably under tough conditions, ensuring consistent performance in demanding applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of various peripheral IC types expands the functionality and versatility of this DSP, making it suitable for a wide range of applications and tasks.

Technology: CMOS

Utilizing CMOS technology enhances the power efficiency and signal processing capabilities of this DSP, making it a reliable and cost-effective solution for diverse applications.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections between the DSP and other components, preventing signal loss and maintaining stable performance.

Nominal Supply Voltage: 1.6 V

Operating at a stable nominal supply voltage ensures consistent and reliable performance of the DSP, making it suitable for long-term use in various applications.

Terminal Pitch: 0.8 mm

With a small terminal pitch, this DSP allows for closer and more densely packed connections, optimizing circuit design and enhancing overall system functionality.

Format: FIXED POINT

Utilizing a fixed-point format for calculations enables accurate and efficient processing of numerical data, making this DSP suitable for tasks that require precise arithmetic operations.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that this DSP has a moderate sensitivity to moisture, making it suitable for use in controlled environments or with proper handling procedures.

Low Power Mode: YES

The availability of a low power mode enhances the energy efficiency of this DSP, allowing for power-saving operation during periods of reduced computational demand.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5510GGWA1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B240

JESD-609 Code:

e0

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

240

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA240,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5510GGWA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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