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TMS320VC5510AZGWA2

Texas Instruments

TMS320VC5510AZGWA2 by Texas Instruments

TMS320VC5510AZGWA2 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and max clock frequency of 50 MHz. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

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Lifecycle Status

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8

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Chip Stock

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Vyrian

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Digiode

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Cyclops Electronics Ltd

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NexGen Digital

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ComSIT Distribution GmbH

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Bristol Electronics

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AZTECH Wire

Italy . 514 parts In-Stock

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One Stop Electronics

USA . 755 parts In-Stock

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Corohmni

South Africa . 276 parts In-Stock

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Parana Technologies

USA . 1,392 parts In-Stock

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DigiPath Technology Company

USA . 597 parts In-Stock

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ChromeModa Solutions

Germany . 4,800 parts In-Stock

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IDEA Electronic Components Group

UK . 466 parts In-Stock

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A-Z Elektronik GmbH

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Lixinc

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Microchip USA

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Overview

Experience the cutting-edge technology of the TMS320VC5510AZGWA2 by Texas Instruments, a top-tier manufacturer known for its high-quality digital signal processors. This versatile DSP offers integrated cache, low power mode, and an extensive range of applications in industries such as telecommunications, audio processing, and industrial control systems. With a focus on performance and efficiency, this product provides exceptional value to customers seeking reliable and innovative solutions for their projects. Harness the power of Texas Instruments and elevate your designs with the TMS320VC5510AZGWA2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides a durable and cost-effective packaging option for the DSP, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache helps in improving the processing speed and efficiency of the DSP, making it a suitable choice for tasks requiring quick data retrieval.

Maximum Supply Voltage: 1.65 V

The maximum supply voltage of 1.65 V ensures efficient power consumption and reliable performance of the DSP.

On Chip Data RAM Width: 16

With a width of 16, the on-chip data RAM provides ample space for storing and processing data, enhancing the overall performance of the DSP.

Address Bus Width: 22

A wider address bus width of 22 allows for efficient communication between different components, enabling faster data transfer within the DSP.

Bit Size: 16

The 16-bit architecture of the DSP allows for processing and handling data in a more efficient manner, making it suitable for various digital signal processing tasks.

Power Supplies (V): 1.6,3.3

Having multiple power supply options (1.6V and 3.3V) increases flexibility in designing and powering the DSP in different applications.

No. of Terminals: 240

Having 240 terminals provides a high level of connectivity and versatility, allowing for integration with other components and peripherals in complex systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP being categorized as a digital signal processor along with other peripheral IC types showcases its focus and specialization in processing digital signals efficiently.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5510AZGWA2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B240

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

6

No. of Terminals:

240

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA240,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5510AZGWA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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