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TMS320VC5510AZGW2

Texas Instruments

TMS320VC5510AZGW2 by Texas Instruments

TMS320VC5510AZGW2 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and 50 MHz max clock frequency. Ideal for digital signal processing applications requiring low power consumption and fixed-point format calculations.

Median Price

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Lifecycle Status

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6

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Digiode

USA . 1,873 parts In-Stock

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Vyrian

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Nova Conductors

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Elcom Components

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ACDS - Activité Composants Distribution Service

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PC Components Company LLC

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AZTECH Wire

Italy . 485 parts In-Stock

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$5.759

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One Stop Electronics

USA . 517 parts In-Stock

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Ampacity Inc.

Singapore . 770 parts In-Stock

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Corohmni

South Africa . 53 parts In-Stock

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Parana Technologies

USA . 182 parts In-Stock

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$52.150

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DigiPath Technology Company

USA . 340 parts In-Stock

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$52.830

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ChromeModa Solutions

Germany . 6,056 parts In-Stock

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IDEA Electronic Components Group

UK . 2,059 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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S.R.D Solutions

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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A-Z Elektronik GmbH

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Metaverse IC Inc.

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Microchip USA

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Speed Components Ltd (Excess)

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GreenTree Electronics

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Kepictronics

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Overview

Unlock the power of digital signal processing with the Texas Instruments TMS320VC5510AZGW2! This cutting-edge DSP offers unparalleled performance and reliability, thanks to its advanced integrated cache and low power mode. Whether you're working on audio processing, telecommunications, or industrial automation, this versatile processor has you covered. With Texas Instruments' renowned reputation for quality and innovation, you can trust that you're getting a top-of-the-line product that will exceed your expectations. Upgrade your projects today with the TMS320VC5510AZGW2 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to external elements, making the product suitable for various environments.

Integrated Cache: YES

Integrated cache improves processing speed and efficiency by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.65 V

Operates efficiently at a maximum supply voltage of 1.65V, ensuring stable performance and power consumption.

On Chip Data RAM Width: 16

Wide data RAM width of 16 bits allows for efficient data processing and faster operations.

Address Bus Width: 22

Wide address bus width of 22 bits enables the processor to access a larger memory space, enhancing overall performance.

Bit Size: 16

16-bit architecture allows for processing and manipulation of data in smaller chunks, enabling faster computation.

Power Supplies (V): 1.6,3.3

Supports multiple power supply voltages of 1.6V and 3.3V, offering flexibility in power management and optimization.

No. of Terminals: 240

240 terminals provide ample connectivity options for interfacing with other components or peripherals, enhancing versatility.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor, the product is specifically designed for handling digital signal processing tasks efficiently and accurately.

Maximum Clock Frequency: 50 MHz

High maximum clock frequency of 50 MHz allows for swift data processing and real-time signal handling, making it suitable for demanding applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5510AZGW2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B240

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

6

No. of Terminals:

240

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA240,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5510AZGW2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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