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TMS320VC5510AGBC2

Texas Instruments

TMS320VC5510AGBC2 by Texas Instruments

TMS320VC5510AGBC2 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and 50 MHz max clock frequency. Ideal for digital signal processing applications requiring low power consumption and fixed-point format calculations.

Median Price

$32.518

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 972 parts In-Stock

1+ parts

$25.476

100+ parts

$22.645

1k+ parts

$16.651

10k+ parts

-

972

$25.476

$22.645

$16.651

-

Mouser Electronics

USA . 126 parts In-Stock

1+ parts

$39.560

100+ parts

$27.760

1k+ parts

$27.190

10k+ parts

-

126

$39.560

$27.760

$27.190

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,653 parts In-Stock

1+ parts

$24.202

100+ parts

-

1k+ parts

-

10k+ parts

-

3,653

$24.202

-

-

-

Vyrian

USA . 4,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,530

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,440 parts In-Stock

1+ parts

$22.928

100+ parts

-

1k+ parts

-

10k+ parts

-

4,440

$22.928

-

-

-

Component Stockers USA

USA . 115 parts In-Stock

1+ parts

$31.340

100+ parts

$24.710

1k+ parts

-

10k+ parts

-

115

$31.340

$24.710

-

-

Microchip USA

USA . 1,585 parts In-Stock

1+ parts

$58.790

100+ parts

$57.770

1k+ parts

$57.260

10k+ parts

$56.750

1,585

$58.790

$57.770

$57.260

$56.750

Parana Technologies

USA . 1,650 parts In-Stock

1+ parts

$76.430

100+ parts

-

1k+ parts

-

10k+ parts

-

1,650

$76.430

-

-

-

Corohmni

South Africa . 500 parts In-Stock

1+ parts

$76.867

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$76.867

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-

-

IDEA Electronic Components Group

UK . 634 parts In-Stock

1+ parts

$85.876

100+ parts

$81.582

1k+ parts

$77.288

10k+ parts

-

634

$85.876

$81.582

$77.288

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ChromeModa Solutions

Germany . 611 parts In-Stock

1+ parts

$85.876

100+ parts

$70.418

1k+ parts

-

10k+ parts

-

611

$85.876

$70.418

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-

DigiPath Technology Company

USA . 559 parts In-Stock

1+ parts

-

100+ parts

$77.426

1k+ parts

-

10k+ parts

-

559

-

$77.426

-

-

Overview

Unlock the power of high-quality digital signal processing with the TMS320VC5510AGBC2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers superior products like this DSP that offer integrated cache, low power mode, and boundary scan capabilities. Ideal for applications such as audio processing and telecommunications, this DSP provides customers with reliable performance, efficient operation, and exceptional value. Experience the benefits of advanced technology with the TMS320VC5510AGBC2 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP, making it suitable for various applications.

Integrated Cache: YES

The integrated cache helps in improving the processing speed and efficiency of the DSP, making it ideal for high-performance tasks.

Maximum Supply Voltage: 1.65 V

The higher maximum supply voltage allows for increased flexibility in power requirements and operation of the DSP.

Surface Mount: YES

The surface mount feature enables easy and secure installation on PCBs, saving space and facilitating automated assembly.

Address Bus Width: 22

A wider address bus width increases the memory addressing capability of the DSP, allowing for efficient data handling and processing.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and efficient design for the DSP, enabling high-density integration in advanced electronic systems.

No. of External Interrupts: 6

The multiple external interrupts support simultaneous external events handling, enhancing the real-time responsiveness of the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The specific peripheral IC type indicates that the DSP is optimized for digital signal processing tasks, ensuring high performance in signal manipulation applications.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency allows for fast processing speeds, making the DSP suitable for real-time signal processing and high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable for long-term operation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5510AGBC2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B240

JESD-609 Code:

e0

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

6

No. of Terminals:

240

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA240,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5510AGBC2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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