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TMS320VC5507ZHH

Texas Instruments

TMS320VC5507ZHH by Texas Instruments

TMS320VC5507ZHH by Texas Instruments is a 16-bit DSP with 179 terminals, operating at up to 50 MHz. Ideal for industrial applications, it features a low power mode and on-chip data RAM width of 16 bits. With boundary scan capability and multiple internal bus architecture, it offers versatile digital signal processing solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,452 parts In-Stock

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Digiode

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Bristol Electronics

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Atlantic Semiconductor

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AZTECH Wire

Italy . 297 parts In-Stock

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$7.612

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One Stop Electronics

USA . 1,254 parts In-Stock

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$19.000

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Corohmni

South Africa . 1,168 parts In-Stock

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Parana Technologies

USA . 461 parts In-Stock

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DigiPath Technology Company

USA . 1,231 parts In-Stock

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$63.378

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$58.307

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ChromeModa Solutions

Germany . 6,585 parts In-Stock

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$64.671

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IDEA Electronic Components Group

UK . 805 parts In-Stock

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S.R.D Solutions

India . 15,000 parts In-Stock

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Perfect Parts

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Corphita

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Kepictronics

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Microchip USA

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Overview

Unlock the power of digital signal processing with the TMS320VC5507ZHH by Texas Instruments. Crafted with precision and expertise, this DSP offers unparalleled performance and reliability. Ideal for a wide range of applications, from audio processing to telecommunications, this cutting-edge technology provides customers with unmatched value and benefits. Experience seamless operation, superior quality, and endless possibilities with the TMS320VC5507ZHH - the ultimate choice for all your DSP needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic body material makes the product lightweight and durable, making it suitable for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy assembly and integration into various electronic devices.

Maximum Supply Voltage: 1.65 V

Low maximum supply voltage helps in reducing power consumption and increasing efficiency of the product.

On Chip Data RAM Width: 16

Wide on-chip data RAM width allows for faster data processing and seamless multitasking capabilities.

Address Bus Width: 21

Wider address bus width enables the processor to access a larger memory space efficiently.

Package Shape: SQUARE

Square package shape allows for efficient use of space in electronic device designs.

Bit Size: 16

16-bit architecture provides a balance between performance and power efficiency for various signal processing tasks.

Power Supplies (V): 1.6,3.3

Multiple power supply options provide flexibility in operation and compatibility with different voltage requirements.

No. of Terminals: 179

A high number of terminals enable connectivity to various external components and peripherals, expanding the product's functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch offers high density integration and efficient signal routing on the PCB.

Minimum Supply Voltage: 1.55 V

Low minimum supply voltage ensures the processor can operate efficiently even at low power levels, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the processor to withstand harsh environmental conditions without compromising performance.

No. of External Interrupts: 5

Multiple external interrupts allow the processor to respond quickly to external events and handle time-sensitive tasks effectively.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the processor can operate reliably in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies the PCB layout and facilitates easier assembly and soldering.

Maximum Seated Height: 1.4 mm

Low maximum seated height allows for slim and compact device designs while maintaining a high level of performance.

RAM Words: 65536

Large RAM capacity enables the processor to store and access a significant amount of data for complex signal processing tasks.

Width: 12 mm

Compact width makes the product suitable for space-constrained applications where size is a critical factor.

Boundary Scan: YES

Boundary scan capability enhances testing and debugging processes, ensuring easier maintenance and troubleshooting of the product.

External Data Bus Width: 16

Wide external data bus width allows for high-speed data transfer between the processor and external memory or peripherals.

Maximum Clock Frequency: 50 MHz

High maximum clock frequency enables fast processing speed and real-time performance for demanding signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature minimizes the risk of thermal damage during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering and assembly of the product under elevated temperature conditions.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for parallel processing and efficient data transfer within the processor for improved performance.

Length: 12 mm

Compact length complements the width to provide a small form factor design for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the processor can operate reliably in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated digital signal processor peripheral IC type enhances signal processing capabilities and expands the product's functionality.

No. of Timers: 3

Multiple timers enable the processor to schedule and coordinate time-sensitive tasks efficiently, enhancing real-time processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high-speed operation for energy-efficient and reliable performance.

Terminal Form: BALL

Ball terminal form simplifies soldering and assembly processes, ensuring reliable electrical connections and robust mechanical strength.

Nominal Supply Voltage: 1.6 V

Stable nominal supply voltage ensures consistent and reliable operation of the processor in various operating conditions.

No. of DMA Channels: 6

Multiple DMA channels enable efficient data transfer between memory and peripherals, reducing CPU overhead and improving overall system performance.

ROM Programmability: MROM

MROM programmability offers secure and reliable storage of firmware and software code for long-term operation without the risk of data loss.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting on the PCB, saving space and enabling compact device designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and improves efficiency for computational tasks in signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the product can withstand moderate exposure to moisture during storage and handling without compromising performance.

Low Power Mode: YES

Low power mode capability enhances energy efficiency and extends battery life, making the product suitable for portable and battery-powered devices.

On Chip Program ROM Width: 16

Wide on-chip program ROM width accommodates larger firmware and software code for enhanced functionality and performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5507ZHH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2V AND 1.35 V SUPPLY

Address Bus Width:

21

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of Terminals:

179

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5507ZHH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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