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TMS320VC549PGE-120

Texas Instruments

TMS320VC549PGE-120 by Texas Instruments

TMS320VC549PGE-120 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20MHz. Ideal for industrial applications, it features low power mode, barrel shifter, and boundary scan support. With a package style of flatpack and terminal pitch of 0.5mm, it offers high performance in a compact form factor.

Median Price

$50.370

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$43.690

1k+ parts

$39.090

10k+ parts

$36.790

10

-

$43.690

$39.090

$36.790

DigiKey

USA . 10 parts In-Stock

1+ parts

-

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10

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Verical

USA . 10 parts In-Stock

1+ parts

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100+ parts

$57.050

1k+ parts

$51.587

10k+ parts

-

10

-

$57.050

$51.587

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,950 parts In-Stock

1+ parts

$46.122

100+ parts

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3,950

$46.122

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-

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Vyrian

USA . 4,983 parts In-Stock

1+ parts

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4,983

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DigiKey Marketplace

USA . 10 parts In-Stock

1+ parts

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10

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LIBRA Elektronik GmbH

Germany . 2 parts In-Stock

1+ parts

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 304 parts In-Stock

1+ parts

$37.653

100+ parts

-

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304

$37.653

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Corphita

USA . 2,711 parts In-Stock

1+ parts

$43.695

100+ parts

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2,711

$43.695

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Parana Technologies

USA . 466 parts In-Stock

1+ parts

$49.959

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466

$49.959

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DigiPath Technology Company

USA . 2,236 parts In-Stock

1+ parts

$55.011

100+ parts

$50.610

1k+ parts

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2,236

$55.011

$50.610

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ChromeModa Solutions

Germany . 1,092 parts In-Stock

1+ parts

$56.134

100+ parts

$46.030

1k+ parts

-

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1,092

$56.134

$46.030

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IDEA Electronic Components Group

UK . 78 parts In-Stock

1+ parts

$56.134

100+ parts

$53.327

1k+ parts

$50.521

10k+ parts

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78

$56.134

$53.327

$50.521

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Microchip USA

USA . 353 parts In-Stock

1+ parts

$107.180

100+ parts

$105.320

1k+ parts

$104.380

10k+ parts

$103.450

353

$107.180

$105.320

$104.380

$103.450

Lixinc

USA . 11,557 parts In-Stock

1+ parts

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11,557

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Perfect Parts

USA . 67 parts In-Stock

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320VC549PGE-120 by Texas Instruments, a leading manufacturer renowned for its high-quality digital signal processors. Ideal for a wide range of applications, this DSP offers unparalleled performance and efficiency, providing customers with value and benefits that set them apart from the competition. Experience seamless operation and enhanced functionality with this innovative product, designed to meet the demands of today's dynamic market. Trust Texas Instruments to deliver superior solutions that exceed expectations and drive success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 2.75 V

Ensures safe operation within the specified voltage limits, protecting the DSP from potential damage.

Address Bus Width: 23

Provides a wide range of memory addressability for efficient data processing and storage.

Package Shape: SQUARE

Helps in optimizing space on the PCB and facilitates uniform heat dissipation for better performance.

Bit Size: 16

Offers a good balance between processing power and energy efficiency for various applications.

Power Supplies (V): 2.5,3.3

Supports different voltage requirements, making the DSP versatile and compatible with various systems.

No. of Terminals: 144

Provides ample connectivity options for interfacing with external components, enhancing the functionality of the DSP.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These styles offer flexibility in mounting options and enable compact designs for space-constrained applications.

Minimum Supply Voltage: 2.4 V

Allows for operation at lower voltages, improving energy efficiency and reducing power consumption.

Maximum Operating Temperature: 100 °C

Ensures reliable performance even in high-temperature environments, making the DSP suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Maintains functionality in harsh cold conditions, expanding the usability of the DSP in various settings.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures good electrical conductivity, enhancing the longevity and reliability of the terminals.

Terminal Position: QUAD

Facilitates easy soldering and enhances signal integrity, contributing to the overall performance of the DSP.

Maximum Seated Height: 1.6 mm

Enables low-profile designs and compact form factors, ideal for applications with space constraints.

RAM Words: 65536

Offers sufficient memory capacity for data storage and processing, supporting complex algorithms and computations.

Width: 20 mm

Compact dimensions allow for integration into small devices without compromising on performance.

Boundary Scan: YES

Facilitates testing and debugging of the DSP during production, ensuring quality and reliability.

External Data Bus Width: 16

Enables fast data transfer between the DSP and external devices, enhancing overall system efficiency.

Maximum Clock Frequency: 20 MHz

Provides high-speed processing capabilities for quick execution of tasks and real-time data processing.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reliability during manufacturing processes, reducing the risk of component failure.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow processes, ensuring the integrity of the DSP during assembly.

Internal Bus Architecture: MULTIPLE

Allows for efficient data transfer within the DSP, optimizing performance and enhancing overall system speed.

Length: 20 mm

Compact dimensions enable versatile placement options and efficient use of space on the PCB.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, making the DSP suitable for rugged environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports a variety of peripheral devices and interfaces, expanding the connectivity options for the DSP.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the DSP.

Terminal Form: GULL WING

Facilitates easy soldering and provides mechanical strength, ensuring secure connections for optimal performance.

Nominal Supply Voltage: 2.5 V

Maintains stable operation within the specified voltage range, ensuring consistent performance of the DSP.

Terminal Pitch: 0.5 mm

Allows for compact layout designs and efficient use of space on the PCB, ideal for miniaturized applications.

Format: FIXED POINT

Enables efficient numerical computations and signal processing tasks, enhancing the computational capabilities of the DSP.

Low Power Mode: YES

Facilitates energy-saving operation, prolonging battery life and reducing power consumption in portable devices.

Barrel Shifter: YES

Improves the efficiency of shift operations and arithmetic calculations, enhancing the processing speed of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC549PGE-120 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC549PGE-120 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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