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TMS320VC549PGE-100

Texas Instruments

TMS320VC549PGE-100 by Texas Instruments

TMS320VC549PGE-100 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20MHz. Ideal for industrial applications requiring low power consumption and fixed-point processing. Features include 144 terminals, 65536 RAM words, and boundary scan capability.

Median Price

$43.810

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

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Rochester

USA . 2,469 parts In-Stock

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$42.930

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PC Components Company LLC

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Digital Electronic Gebert Verwaltungs UG

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Zilex Electronics Inc.

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Connect4Technologies Inc.

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Manoshevitz Elec. Sales

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Q Components

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Connector Distribution Corp

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Bristol Electronics

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Component Stockers USA

USA . 3,889 parts In-Stock

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$13.980

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$10.690

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$12.860

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AZTECH Wire

Italy . 666 parts In-Stock

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One Stop Electronics

USA . 527 parts In-Stock

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Parana Technologies

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Corohmni

South Africa . 1,029 parts In-Stock

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ChromeModa Solutions

Germany . 4,083 parts In-Stock

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IDEA Electronic Components Group

UK . 1,937 parts In-Stock

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DigiPath Technology Company

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Corphita

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Microchip USA

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ChipstoGo Electronic ltd

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Overview

Unlock the power of digital signal processing with the TMS320VC549PGE-100 by Texas Instruments. Designed with precision and expertise, this DSP offers unparalleled performance and reliability for a wide range of applications. Whether you're working on audio processing, telecommunications, or industrial control systems, this product delivers the value and benefits you need to bring your projects to life. Trust in Texas Instruments to provide cutting-edge technology that will take your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it is lightweight, durable, and cost-effective.

Surface Mount: YES

Surface mount technology allows for a higher component density on the PCB, making the product compact and efficient.

Maximum Supply Voltage: 2.75 V

The tolerance for a maximum supply voltage of 2.75V ensures the product's stability and reliable performance.

Address Bus Width: 23

A wider address bus width allows for efficient communication between different components within the DSP, enhancing its processing capabilities.

Bit Size: 16

A 16-bit architecture allows for higher precision and accuracy in signal processing tasks.

Power Supplies (V): 2.5, 3.3

Support for multiple power supply voltages provides flexibility in different application scenarios.

No. of Terminals: 144

Having a higher number of terminals allows for the connection of multiple external devices, expanding the product's functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade operations, this DSP can withstand harsh environmental conditions and extended operating hours.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatility in peripheral IC types allows the DSP to cater to a wide range of signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC549PGE-100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC549PGE-100 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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