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TMS320VC5470ZHK

Texas Instruments

TMS320VC5470ZHK by Texas Instruments

TMS320VC5470ZHK by Texas Instruments is a 16-bit DSP with 32-bit external data bus, operating at max 50 MHz. It features 16384 RAM words and low power mode, suitable for digital signal processing applications requiring high-speed performance in a compact package.

Median Price

$15.620

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 970 parts In-Stock

1+ parts

$15.620

100+ parts

$15.310

1k+ parts

$15.000

10k+ parts

-

970

$15.620

$15.310

$15.000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,336 parts In-Stock

1+ parts

-

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6,336

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Digiode

USA . 417 parts In-Stock

1+ parts

-

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417

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Bristol Electronics

USA . 360 parts In-Stock

1+ parts

-

100+ parts

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360

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Distributors (Availability)

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AZTECH Wire

Italy . 871 parts In-Stock

1+ parts

$12.745

100+ parts

-

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871

$12.745

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One Stop Electronics

USA . 957 parts In-Stock

1+ parts

$32.000

100+ parts

-

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957

$32.000

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Parana Technologies

USA . 959 parts In-Stock

1+ parts

$67.014

100+ parts

-

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959

$67.014

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ChromeModa Solutions

Germany . 2,199 parts In-Stock

1+ parts

$75.297

100+ parts

$61.744

1k+ parts

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2,199

$75.297

$61.744

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IDEA Electronic Components Group

UK . 1,765 parts In-Stock

1+ parts

$75.297

100+ parts

$71.532

1k+ parts

$67.767

10k+ parts

-

1,765

$75.297

$71.532

$67.767

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Corohmni

South Africa . 1,158 parts In-Stock

1+ parts

$86.279

100+ parts

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1,158

$86.279

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A-Z Elektronik GmbH

Germany . 4,820 parts In-Stock

1+ parts

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4,820

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Corphita

USA . 4,411 parts In-Stock

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4,411

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Microchip USA

USA . 2,688 parts In-Stock

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2,688

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Kepictronics

USA . 360 parts In-Stock

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360

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DigiPath Technology Company

USA . 262 parts In-Stock

1+ parts

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100+ parts

$67.888

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262

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$67.888

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Overview

Unlock the power of cutting-edge technology with the TMS320VC5470ZHK by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their digital signal processors. Perfect for a wide range of applications, this DSP offers unmatched performance and efficiency. Experience seamless operation and superior results with the TMS320VC5470ZHK, providing customers with exceptional value and endless possibilities. Elevate your projects to new heights with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the DSP, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and efficient mounting onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.95 V

Ensures safe operation within specified voltage limits, preventing damage to the DSP.

Address Bus Width: 23

Allows for efficient memory addressing and data transfer, enhancing the performance of the DSP.

Package Shape: SQUARE

Optimizes space utilization on circuit boards, making it suitable for compact electronic devices.

Bit Size: 16

Provides sufficient processing power for handling complex digital signal processing tasks effectively.

Power Supplies (V): 1.8,3.3

Offers flexibility in power input options, allowing compatibility with various power sources.

No. of Terminals: 257

Enables seamless connectivity with other components, facilitating data exchange and communication.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Facilitates high-density mounting and efficient thermal management, enhancing overall system performance.

Minimum Supply Voltage: 1.71 V

Ensures reliable operation even under low voltage conditions, improving system stability.

Maximum Operating Temperature: 85 °C

Allows the DSP to function effectively in a wide range of environmental conditions, increasing versatility.

Minimum Operating Temperature: 0 °C

Ensures operational reliability in cold temperature environments, making the DSP suitable for various applications.

Terminal Finish: TIN SILVER COPPER

Enhances the conductivity and durability of the terminals, ensuring reliable electrical connections.

RAM Words: 16384

Provides ample memory capacity for storing and processing data efficiently, enhancing the performance of the DSP.

Width: 16 mm

Compact size enables integration into space-constrained devices without compromising performance.

Boundary Scan: YES

Facilitates debugging and testing of the DSP during manufacturing and operation, streamlining the development process.

External Data Bus Width: 32

Enables fast data transfer between the DSP and external devices, improving overall system efficiency.

Maximum Clock Frequency: 50 MHz

Supports high-speed processing of digital signals, making the DSP suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering of the DSP during assembly, contributing to the overall reliability of the product.

Peak Reflow Temperature °C: 260

Optimizes the soldering process for the DSP, ensuring secure attachment to the circuit board.

Internal Bus Architecture: MULTIPLE

Enhances data flow and processing efficiency within the DSP, improving overall performance and speed.

Length: 16 mm

Compact design allows for easy integration into various electronic devices, saving space and enhancing portability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Versatile IC type enables the DSP to handle a wide range of signal processing tasks, increasing its applicability.

Technology: CMOS

Utilizes advanced CMOS technology for efficient power consumption and high-speed operation, improving energy efficiency.

Terminal Form: BALL

Enhances the reliability of connections and solder joints, ensuring stable performance under various conditions.

Nominal Supply Voltage: 1.8 V

Standard supply voltage ensures compatibility with common power sources, simplifying integration into existing systems.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density mounting, allowing for compact and efficient circuit board design.

Format: FIXED POINT

Fixed-point format provides efficient and accurate processing of digital signals, ensuring precise results.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure, increasing the durability and reliability of the DSP.

Low Power Mode: YES

Offers energy-saving capabilities for improved power efficiency, making the DSP ideal for battery-operated devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5470ZHK attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B257

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

257

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5470ZHK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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