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TMS320VC5470GHK

Texas Instruments

TMS320VC5470GHK by Texas Instruments

TMS320VC5470GHK by Texas Instruments is a 16-bit DSP with 32-bit external data bus, operating at max 50 MHz. Ideal for digital signal processing applications, it features low power mode, multiple internal bus architecture, and fixed-point format for efficient computation.

Median Price

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Lifecycle Status

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Vyrian

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Digiode

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DigiKey Marketplace

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PC Components Company LLC

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Bristol Electronics

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ComSIT Distribution GmbH

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LWI Electronics Inc

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Prism Electronics

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AZTECH Wire

Italy . 429 parts In-Stock

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Parana Technologies

USA . 380 parts In-Stock

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DigiPath Technology Company

USA . 2,117 parts In-Stock

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ChromeModa Solutions

Germany . 4,046 parts In-Stock

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IDEA Electronic Components Group

UK . 743 parts In-Stock

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One Stop Electronics

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Corohmni

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Microchip USA

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Overview

Unlock the power of digital signal processing with the TMS320VC5470GHK by Texas Instruments. This high-quality DSP offers unmatched performance and reliability, making it the perfect choice for a wide range of applications. Whether you're working on audio processing, telecommunications, or industrial control systems, this DSP delivers exceptional value and benefits to customers. Trust in Texas Instruments' reputation for excellence and choose the TMS320VC5470GHK for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product portable and affordable.

Surface Mount: YES

Surface mount technology makes the product easy to install and reduces the overall size of the device.

Maximum Supply Voltage: 1.95 V

Allows for flexibility in power supply options while still maintaining a safe operating range.

Address Bus Width: 23

Wide address bus allows for efficient memory addressing and data retrieval.

Bit Size: 16

The 16-bit architecture provides a good balance between performance and power consumption.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options, giving users flexibility in designing their systems.

No. of Terminals: 257

A high number of terminals allows for more connections and interfaces, expanding the capabilities of the product.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This packaging style offers high density and reliability, making it suitable for compact and high-performance applications.

Minimum Supply Voltage: 1.71 V

Ensures reliable operation at low power supply levels, improving energy efficiency.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes the product suitable for a variety of environments.

Minimum Operating Temperature: 0 °C

Operates effectively even in low-temperature conditions.

Terminal Finish: TIN LEAD

Provides good solderability and helps to prevent oxidation, ensuring a reliable connection.

RAM Words: 16384

A large RAM capacity allows for faster data processing and multitasking capabilities.

Width: 16 mm

Compact width makes the product suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan testing enhances the product's reliability and makes it easier to diagnose and troubleshoot issues.

External Data Bus Width: 32

A wide external data bus facilitates faster data transfer rates and enhances overall system performance.

Maximum Clock Frequency: 50 MHz

High clock frequency allows for fast signal processing and execution of complex algorithms.

Internal Bus Architecture: MULTIPLE

Multiple internal buses support parallel processing and improve overall system throughput.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

This versatile peripheral IC type supports a wide range of signal processing applications, making the product suitable for diverse use cases.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting and contributes to the product's compact design.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and enhances computational efficiency.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates good resistance to moisture, ensuring the product's reliability in various environmental conditions.

Low Power Mode: YES

The low power mode option helps conserve energy and extend battery life, making the product suitable for portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5470GHK attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B257

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

257

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5470GHK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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