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TMS320VC5441AZGUZE

Texas Instruments

TMS320VC5441AZGUZE by Texas Instruments

TMS320VC5441AZGUZE by Texas Instruments is a DSP with 169 terminals, operating at -40 to 100 °C. It features low power mode, CMOS technology, and fixed-point format. Ideal for industrial applications requiring digital signal processing capabilities in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,032 parts In-Stock

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3,032

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Digiode

USA . 2,615 parts In-Stock

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2,615

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Distributors (Availability)

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AZTECH Wire

Italy . 269 parts In-Stock

1+ parts

$13.400

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269

$13.400

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One Stop Electronics

USA . 244 parts In-Stock

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$21.000

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244

$21.000

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Corohmni

South Africa . 448 parts In-Stock

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$51.154

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448

$51.154

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Parana Technologies

USA . 1,056 parts In-Stock

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$59.513

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1,056

$59.513

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DigiPath Technology Company

USA . 1,181 parts In-Stock

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$65.532

100+ parts

$60.289

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1,181

$65.532

$60.289

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ChromeModa Solutions

Germany . 3,052 parts In-Stock

1+ parts

$66.869

100+ parts

$54.833

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3,052

$66.869

$54.833

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IDEA Electronic Components Group

UK . 1,067 parts In-Stock

1+ parts

$66.869

100+ parts

$63.526

1k+ parts

$60.182

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1,067

$66.869

$63.526

$60.182

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Component Stockers USA

USA . 246 parts In-Stock

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$99.990

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246

$99.990

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Corphita

USA . 1,210 parts In-Stock

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Microchip USA

USA . 441 parts In-Stock

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441

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Overview

Unlock the power of advanced digital signal processing with the TMS320VC5441AZGUZE by Texas Instruments. This cutting-edge DSP offers unparalleled performance and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this DSP provides customers with high-quality audio and video processing capabilities, making it a valuable asset for any project. Experience the benefits of precision engineering and innovative technology with the TMS320VC5441AZGUZE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during assembly.

Maximum Supply Voltage: 1.65 V

Efficiently handles higher voltage levels, making it suitable for a wide range of applications.

Package Shape: SQUARE

Maximizes space efficiency on the circuit board, allowing for more components to be packed together.

No. of Terminals: 169

Provides numerous connection points for various external devices and peripherals, enhancing the product's versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables a compact and streamlined design, reducing the overall footprint of the product on the PCB.

Minimum Supply Voltage: 1.55 V

Supports low-power operation and extends the battery life of portable devices.

Maximum Operating Temperature: 100 °C

Ensures reliable performance even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Allows for operation in extreme cold conditions without compromising performance, ideal for outdoor applications.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: BOTTOM

Facilitates easy installation and maintenance of the product on the circuit board.

Maximum Seated Height: 1.4 mm

Keeps the overall profile of the product low, making it suitable for compact electronic devices.

Width: 12 mm

Compact width allows for efficient use of space on the PCB, enabling the integration of multiple components.

Boundary Scan: YES

Enables efficient testing and debugging of the circuit, reducing the time and effort required for quality control.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and reliable soldering during the manufacturing process, ensuring a strong and durable connection.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes, ensuring the product's reliability under extreme conditions.

Internal Bus Architecture: MULTIPLE

Enhances data processing speed and efficiency, making the product suitable for demanding computational tasks.

Length: 12 mm

Compact length allows for space-efficient placement on the PCB, enabling a more streamlined design.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments, ensuring long-term performance and durability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports a wide range of applications and peripherals, enhancing the product's versatility and compatibility.

Technology: CMOS

Low power consumption and high-speed performance, making it ideal for battery-powered devices and high-performance applications.

Terminal Form: BALL

Provides secure and reliable connections, ensuring stable performance even under vibration or movement.

Nominal Supply Voltage: 1.6 V

Optimal voltage level for efficient operation and power consumption, balancing performance and energy efficiency.

Terminal Pitch: 0.8 mm

Fine pitch allows for high-density mounting on the PCB, enabling a compact and efficient design.

Format: FIXED POINT

Provides precise and efficient data processing, suitable for applications that require accuracy and reliability.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure, making it suitable for a variety of environments.

Low Power Mode: YES

Enables energy-efficient operation, extending battery life and reducing power consumption in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5441AZGUZE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

169

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5441AZGUZE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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