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TMS320VC5441AZGU

Texas Instruments

TMS320VC5441AZGU by Texas Instruments

TMS320VC5441AZGU by Texas Instruments is a 16-bit DSP with 133 MHz clock frequency, 65536 RAM words, and 24 DMA channels. Ideal for industrial applications requiring low power mode, it features a fixed point format and barrel shifter for efficient signal processing.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,047 parts In-Stock

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Digiode

USA . 2,211 parts In-Stock

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AZTECH Wire

Italy . 488 parts In-Stock

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$16.019

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One Stop Electronics

USA . 1,191 parts In-Stock

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$31.000

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Corohmni

South Africa . 86 parts In-Stock

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Parana Technologies

USA . 709 parts In-Stock

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$74.552

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$6,923.260

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$67.097

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709

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DigiPath Technology Company

USA . 170 parts In-Stock

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$82.091

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ChromeModa Solutions

Germany . 3,466 parts In-Stock

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$83.766

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$68.688

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IDEA Electronic Components Group

UK . 2,212 parts In-Stock

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$83.766

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Corphita

USA . 3,186 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the TMS320VC5441AZGU by Texas Instruments, a leading manufacturer in the industry. This digital signal processor (DSP) offers unparalleled performance and reliability for a wide range of applications. From audio processing to telecommunications, this versatile chip delivers outstanding results, thanks to its advanced features and high-quality construction. Trust Texas Instruments to provide you with the tools you need to succeed in today's fast-paced world. Elevate your projects with the TMS320VC5441AZGU and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material allows for a lightweight and cost-effective design.

Surface Mount: YES

Surface mount capability makes it easy to integrate this DSP into various electronic systems.

Maximum Supply Voltage: 1.65 V

Operating at a low maximum supply voltage makes this DSP energy efficient.

Address Bus Width: 19

Having a wide address bus width provides flexibility and enhances the processing capabilities of the DSP.

Bit Size: 16

16-bit processing allows for handling complex digital signal processing tasks efficiently.

Power Supplies (V): 1.6,3.3

Support for multiple power supplies offers versatility in various system configurations.

No. of Terminals: 169

Having a large number of terminals enables connectivity with other components for seamless operation.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style allows for high-density mounting and efficient use of space in system designs.

Minimum Supply Voltage: 1.55 V

Operating at a low minimum supply voltage ensures efficient performance at lower power consumption levels.

Maximum Operating Temperature: 100 °C

Capable of operating at high temperatures, ideal for industrial applications where heat dissipation is a concern.

No. of External Interrupts: 8

Multiple external interrupts allow for handling external events effectively without compromising the processing tasks.

Minimum Operating Temperature: -40 °C

Operational at low temperatures, making it suitable for use in a wide range of environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy integration and soldering in system designs.

RAM Words: 65536

Large RAM capacity allows for efficient data processing and storage capacity for complex algorithms.

Width: 12 mm

Compact width makes this DSP suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan support enables efficient testing and debugging during development and manufacturing processes.

External Data Bus Width: 16

Having a wide external data bus width enhances data transfer speeds and overall performance.

Maximum Clock Frequency: 133 MHz

High clock frequency allows for fast signal processing and real-time data handling.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process handling within a specified time for reliable soldering connections.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures to ensure durable solder joints.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow efficiency and speed within the DSP.

Length: 12 mm

Compact length design for space-efficient integration in electronic systems.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature conditions for robust performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type for handling various digital signal processing tasks efficiently.

No. of Timers: 8

Multiple timer support for time-sensitive operations and scheduling tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form provides easy soldering and connection reliability in system designs.

Nominal Supply Voltage: 1.6 V

Stable nominal supply voltage for consistent performance in various operating conditions.

No. of DMA Channels: 24

Support for multiple DMA channels enables efficient data transfer and processing tasks.

Terminal Pitch: 0.8 mm

Narrow terminal pitch for high-density mounting and efficient use of PCB space.

Format: FIXED POINT

Fixed-point format for precise numerical calculations and optimized performance in DSP applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, suitable for controlled environment use.

Low Power Mode: YES

Low power mode capability for energy-efficient operation and extended battery life in portable devices.

Barrel Shifter: YES

Barrel shifter feature for efficient data alignment and manipulation in signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5441AZGU attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

19

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

133 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

24

No. of External Interrupts:

8

No. of Terminals:

169

No. of Timers:

8

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5441AZGU Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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