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TMS320VC5441APGF

Texas Instruments

TMS320VC5441APGF by Texas Instruments

TMS320VC5441APGF by Texas Instruments is a 16-bit DSP with 133 MHz clock frequency, 65536 RAM words, and 24 DMA channels. Ideal for industrial applications requiring low power mode, it features a CMOS technology and boundary scan capability.

Median Price

$239.180

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

$239.180

100+ parts

$224.830

1k+ parts

$203.300

10k+ parts

-

3

$239.180

$224.830

$203.300

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,057 parts In-Stock

1+ parts

$227.221

100+ parts

-

1k+ parts

-

10k+ parts

-

2,057

$227.221

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-

-

Vyrian

USA . 7,981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,981

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 424 parts In-Stock

1+ parts

$8.750

100+ parts

-

1k+ parts

-

10k+ parts

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424

$8.750

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-

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Corohmni

South Africa . 2,446 parts In-Stock

1+ parts

$23.174

100+ parts

-

1k+ parts

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10k+ parts

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2,446

$23.174

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Parana Technologies

USA . 2,302 parts In-Stock

1+ parts

$32.929

100+ parts

-

1k+ parts

$115.400

10k+ parts

-

2,302

$32.929

-

$115.400

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DigiPath Technology Company

USA . 2,209 parts In-Stock

1+ parts

$36.259

100+ parts

$33.358

1k+ parts

-

10k+ parts

-

2,209

$36.259

$33.358

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ChromeModa Solutions

Germany . 2,303 parts In-Stock

1+ parts

$36.999

100+ parts

$30.339

1k+ parts

-

10k+ parts

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2,303

$36.999

$30.339

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IDEA Electronic Components Group

UK . 173 parts In-Stock

1+ parts

$36.999

100+ parts

$35.149

1k+ parts

$33.299

10k+ parts

-

173

$36.999

$35.149

$33.299

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Corphita

USA . 1,539 parts In-Stock

1+ parts

$215.262

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1,539

$215.262

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Microchip USA

USA . 215 parts In-Stock

1+ parts

$224.720

100+ parts

$218.720

1k+ parts

$215.730

10k+ parts

$212.730

215

$224.720

$218.720

$215.730

$212.730

Overview

Unleash the power of cutting-edge technology with the TMS320VC5441APGF by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Digital Signal Processors (DSPs) that are perfect for a wide range of applications. Experience seamless performance and unparalleled efficiency with this product, offering customers unbeatable value and benefits. From its high-quality package body material to its advanced features like low power mode and barrel shifter, the TMS320VC5441APGF is a game-changer in the world of digital signal processing. Elevate your projects to new heights with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection to the internal components of the DSP, making it suitable for long-term use.

Maximum Supply Voltage: 1.65 V

With a maximum supply voltage of 1.65 V, this DSP consumes lower power while delivering efficient performance, making it energy-efficient.

Address Bus Width: 19

The 19-bit address bus width allows the DSP to access a larger memory space efficiently, enabling it to handle complex processing tasks effectively.

Bit Size: 16

The 16-bit architecture of this DSP enables it to process data with higher precision and accuracy, making it suitable for applications that require high computational power.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this DSP can withstand high temperature environments, ensuring reliable performance in various conditions.

RAM Words: 65536

The large RAM capacity of 65536 words allows the DSP to store and manipulate a significant amount of data in real-time, making it suitable for applications that require intensive data processing.

Maximum Clock Frequency: 133 MHz

The high maximum clock frequency of 133 MHz enables the DSP to execute instructions at a faster rate, enhancing its overall performance and efficiency.

Format: FIXED POINT

The fixed-point format used in this DSP simplifies arithmetic operations and reduces computational complexity, making it a cost-effective solution for signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5441APGF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

19

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

133 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

24

No. of External Interrupts:

8

No. of Terminals:

176

No. of Timers:

8

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5441APGF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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