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TMS320VC5416PGE120

Texas Instruments

TMS320VC5416PGE120 by Texas Instruments

TMS320VC5416PGE120 by Texas Instruments is a 16-bit DSP with 131072 RAM words, 20 MHz clock frequency, and 23-bit address bus width. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$34.132

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 19 parts In-Stock

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$28.100

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Arrow

USA . 5 parts In-Stock

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$30.180

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Verical

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Texas Instruments

USA . 1,731 parts In-Stock

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$38.085

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$33.853

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$24.892

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DigiKey

USA . 32 parts In-Stock

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$55.500

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$41.435

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$40.282

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$55.500

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Mouser Electronics

USA . 14 parts In-Stock

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$55.500

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$41.440

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$40.280

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14

$55.500

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$40.280

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Distributors (In-Stock)

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Digiode

USA . 2,545 parts In-Stock

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$29.241

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Bristol Electronics

USA . 59 parts In-Stock

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$31.498

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$27.863

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Nova Conductors

Japan . 10 parts In-Stock

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$43.300

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Vyrian

USA . 4,545 parts In-Stock

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Velocity Electronics

USA . 60 parts In-Stock

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Dan-Mar Components

USA . 59 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Elcom Components

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Holdelec - ElecDif-Pro

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Semi Source

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Extreme Components

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EMSNET

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$15.784

100+ parts

$14.363

1k+ parts

$12.943

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$15.784

$14.363

$12.943

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Ampacity Inc.

Singapore . 305 parts In-Stock

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$26.160

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Corphita

USA . 558 parts In-Stock

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$27.702

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Continental Prestige Electronics

USA . 4,008 parts In-Stock

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$43.300

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$42.434

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$43.300

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Netroflash

USA . 2,000 parts In-Stock

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$43.300

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$42.434

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$41.135

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$40.269

2,000

$43.300

$42.434

$41.135

$40.269

Parana Technologies

USA . 775 parts In-Stock

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$72.152

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$6,700.436

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$64.937

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775

$72.152

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DigiPath Technology Company

USA . 1,842 parts In-Stock

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$79.449

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$73.093

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ChromeModa Solutions

Germany . 4,620 parts In-Stock

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$81.070

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$66.477

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IDEA Electronic Components Group

UK . 2,129 parts In-Stock

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$81.070

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$72.963

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Corohmni

South Africa . 1,946 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Perfect Parts

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Kepictronics

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Argo Parts USA

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Overview

Experience unparalleled performance and reliability with the TMS320VC5416PGE120 by Texas Instruments, a leading manufacturer in the digital signal processors category. This versatile product offers a wide range of applications and features to meet your needs. From its high-quality construction to its innovative technology, this DSP provides exceptional value and benefits. Trust in Texas Instruments for top-of-the-line products that deliver superior results every time. Elevate your projects with the TMS320VC5416PGE120 and experience the advantages it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and reliability for the product.

Maximum Supply Voltage: 1.65 V

Higher maximum supply voltage allows for flexibility in power supply options.

Address Bus Width: 23

Wide address bus width enables handling of large memory spaces efficiently.

Bit Size: 16

16-bit processing capability provides a good balance between performance and power consumption.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliability in various environmental conditions.

RAM Words: 131072

Large RAM capacity allows for efficient data processing and storage.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated digital signal processing capability makes this product suitable for signal processing applications.

Low Power Mode: YES

Low power mode capability helps in energy efficiency and extending battery life.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5416PGE120 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

131072

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5416PGE120 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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