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TMS320VC5410APGE12

Texas Instruments

TMS320VC5410APGE12 by Texas Instruments

TMS320VC5410APGE12 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20MHz. Ideal for industrial applications requiring low power consumption and fixed-point processing. Features include on-chip data RAM of 16 bits and boundary scan capability.

Median Price

$23.800

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Chip1Stop

Japan . 9 parts In-Stock

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$23.800

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$15.000

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$12.800

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Mouser Electronics

USA . 199 parts In-Stock

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$34.600

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$25.700

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$24.520

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$34.600

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$24.520

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Rochester

USA . 2 parts In-Stock

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-

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$20.940

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$18.730

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$17.630

2

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$17.630

Distributors (In-Stock)

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Digiode

USA . 2,733 parts In-Stock

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$17.480

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Vyrian

USA . 5,212 parts In-Stock

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Chip Stock

USA . 4,995 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,157 parts In-Stock

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Sensible Micro Corp

USA . 757 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

USA . 147 parts In-Stock

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Legend Electronics Inc.

USA . 137 parts In-Stock

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North Shore Components

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Semi Source

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Inventory MP

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J & M Industries LLC

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Prism Electronics

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Component Stockers USA

USA . 7 parts In-Stock

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$15.260

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Corphita

USA . 2,717 parts In-Stock

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$16.560

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Parana Technologies

USA . 1,391 parts In-Stock

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$76.994

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$7,150.052

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$69.295

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$7,150.052

$69.295

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DigiPath Technology Company

USA . 192 parts In-Stock

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$84.780

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$84.780

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Corohmni

South Africa . 4,975 parts In-Stock

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$85.040

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ChromeModa Solutions

Germany . 1,969 parts In-Stock

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$86.510

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$70.938

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$86.510

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IDEA Electronic Components Group

UK . 209 parts In-Stock

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$86.510

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$82.184

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$77.859

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A-Z Elektronik GmbH

Germany . 7,094 parts In-Stock

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Perfect Parts

USA . 665 parts In-Stock

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Kepictronics

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Speed Components Ltd (Excess)

Israel . 149 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TMS320VC5410APGE12 by Texas Instruments, a leading manufacturer of high-quality Digital Signal Processors (DSPs). This powerful device offers a wide range of applications in various industries, providing exceptional value and benefits to customers. With innovative features and advanced technology, this product guarantees superior functionality and efficiency, making it the ideal choice for your next project. Trust Texas Instruments for top-of-the-line solutions that drive success and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the DSP, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation of the DSP on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.65 V

Operating within a maximum supply voltage of 1.65V ensures efficient power consumption and prevents potential damage to the DSP.

On Chip Data RAM Width: 16

Having a data RAM width of 16 allows for efficient data processing and storage, enhancing the performance of the DSP in handling complex tasks.

Address Bus Width: 23

A wide address bus width of 23 enables the DSP to access a large memory space, improving its capability to process and manage data effectively.

Package Shape: SQUARE

The square package shape offers a compact design for the DSP, making it suitable for space-constrained applications without compromising on performance.

Bit Size: 16

Utilizing a 16-bit architecture allows for efficient processing of data in the DSP, enabling high-speed calculations and operations for various tasks.

Power Supplies (V): 1.5, 3/3.3

Supporting multiple power supply options ensures compatibility with different voltage requirements, making the DSP versatile for a wide range of applications.

No. of Terminals: 144

Having a high number of terminals provides ample connectivity options for interfacing with external devices, enhancing the versatility and functionality of the DSP.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package styles offers space-saving and efficient mounting options for the DSP on circuit boards, optimizing the overall system design.

Minimum Supply Voltage: 1.42 V

Operating within a minimum supply voltage of 1.42V ensures reliable performance and stability of the DSP under varying voltage conditions, making it a robust choice for different applications.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, the DSP can withstand high-temperature environments, making it suitable for industrial applications where temperature fluctuations occur.

No. of External Interrupts: 4

Having 4 external interrupts enables the DSP to respond quickly to external events or signals, improving its real-time processing capabilities for time-sensitive applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the DSP can operate in harsh cold environments without compromising its performance, ensuring reliability in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the DSP in various applications.

Terminal Position: QUAD

Quad terminal positioning enables secure and stable connections for external interfacing, ensuring reliable data transmission and communication capabilities for the DSP.

Maximum Seated Height: 1.6 mm

With a maximum seated height of 1.6mm, the DSP offers a compact and low-profile design for space-constrained applications, enhancing the flexibility and integration options for the product.

RAM Words: 65536

Having a large RAM capacity of 65536 words allows the DSP to store and process a significant amount of data efficiently, enabling complex algorithms and calculations to be performed seamlessly.

Width: 20 mm

With a width of 20mm, the DSP's compact size facilitates easy integration into various electronic systems, making it a versatile choice for compact and portable devices.

Boundary Scan: YES

Boundary scan capability offers enhanced testing and debugging features for the DSP, enabling efficient verification and troubleshooting of the device during manufacturing or system integration.

External Data Bus Width: 16

An external data bus width of 16 allows for high-speed data transfer between the DSP and external memory or peripherals, improving overall system performance and efficiency.

Maximum Clock Frequency: 20 MHz

Operating at a maximum clock frequency of 20MHz enables the DSP to execute operations quickly and accurately, delivering high-performance computing capabilities for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, the DSP can undergo soldering processes efficiently, ensuring reliable assembly and connectivity for the device.

Peak Reflow Temperature °C: 260

Having a peak reflow temperature of 260°C ensures proper soldering of the DSP components onto circuit boards, maintaining solder joint integrity and reliability in harsh operating conditions.

Internal Bus Architecture: MULTIPLE

Utilizing a multiple internal bus architecture enhances data processing efficiency within the DSP, enabling concurrent operations and seamless communication between different components on the chip.

Length: 20 mm

With a length of 20mm, the DSP's compact form factor allows for easy integration into various electronic systems, making it a versatile solution for applications with space constraints.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature requirements, the DSP can operate reliably in harsh environmental conditions, making it suitable for rugged industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

As a digital signal processor with additional peripheral functions, the DSP offers versatile processing capabilities for a wide range of applications, enhancing the overall performance and functionality of the system.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity for the DSP, making it energy-efficient and reliable for battery-powered or sensitive electronic devices.

Terminal Form: GULL WING

The gull wing terminal form factor offers secure and reliable connections for the DSP, ensuring stable interfacing with external components and minimizing the risk of signal loss or disconnection.

Nominal Supply Voltage: 1.5 V

Having a nominal supply voltage of 1.5V ensures stable and efficient operation of the DSP, maintaining reliable performance and power efficiency in various operating conditions.

No. of DMA Channels: 6

With 6 DMA channels, the DSP can efficiently manage data transfer and processing tasks, improving overall system performance and reducing CPU overhead for enhanced computational capabilities.

ROM Programmability: MROM

MROM programmability allows for secure and permanent storage of firmware or code in the DSP, ensuring reliable and consistent operation without the risk of data loss or corruption.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the DSP offers high-density connectivity options for interfacing with external components, enabling compact design layouts and efficient signal transmission.

Format: FIXED POINT

Utilizing a fixed-point format for data processing provides precision and accuracy in numerical computations, enabling the DSP to perform complex mathematical operations with high reliability and efficiency.

Low Power Mode: YES

Supporting a low power mode option allows the DSP to reduce power consumption during idle or low activity periods, prolonging battery life and enhancing energy efficiency for portable or battery-powered devices.

Barrel Shifter: YES

Having a barrel shifter feature enables the DSP to perform bitwise shift operations efficiently, enhancing data manipulation capabilities and speeding up arithmetic and logical calculations for improved performance.

On Chip Program ROM Width: 16

With an on-chip program ROM width of 16, the DSP can store and execute program instructions efficiently, enabling fast and reliable program execution for various applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5410APGE12 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3/3.3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5410APGE12 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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