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TMS320VC5410AGGU12

Texas Instruments

TMS320VC5410AGGU12 by Texas Instruments

TMS320VC5410AGGU12 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20 MHz. Ideal for industrial applications requiring low power consumption and fixed-point processing. Features include 65536 RAM words, 1.5-3.3V power supplies, and on-chip data RAM width of 16 bits.

Median Price

$17.410

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 31 parts In-Stock

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$17.410

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$17.060

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$16.710

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Vyrian

USA . 6,356 parts In-Stock

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Digiode

USA . 1,399 parts In-Stock

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Bristol Electronics

USA . 64 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Semi Source

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One Stop Electronics

USA . 237 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 544 parts In-Stock

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$5.811

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Ampacity Inc.

Singapore . 1,275 parts In-Stock

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$11.000

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Parana Technologies

USA . 1,241 parts In-Stock

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$63.835

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DigiPath Technology Company

USA . 1,335 parts In-Stock

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$70.290

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ChromeModa Solutions

Germany . 4,574 parts In-Stock

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$71.725

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$58.814

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IDEA Electronic Components Group

UK . 1,985 parts In-Stock

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$71.725

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$68.139

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$64.552

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Corohmni

South Africa . 101 parts In-Stock

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

USA . 5,224 parts In-Stock

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Microchip USA

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Futuretech Components

Singapore . 3,840 parts In-Stock

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Corphita

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Kepictronics

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Overview

Unlock the power of digital signal processing with the TMS320VC5410AGGU12 by Texas Instruments. This versatile DSP offers top-of-the-line quality and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications, this DSP provides customers with unparalleled value and benefits. Experience seamless performance and precision with the TMS320VC5410AGGU12, delivering unmatched advantages to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy installation and better thermal performance.

Maximum Supply Voltage: 1.65 V

The low maximum supply voltage helps in minimizing power consumption and heat dissipation.

On Chip Data RAM Width: 16

The wide data RAM width allows for faster data processing and storage.

Address Bus Width: 23

The wide address bus width enables efficient memory addressing and access.

Package Shape: SQUARE

The square package shape allows for easy mounting and efficient use of space on a PCB.

Bit Size: 16

The 16-bit size is suitable for handling a wide range of computational tasks efficiently.

Power Supplies (V): 1.5,3/3.3

The availability of multiple power supply options offers flexibility in design and compatibility with different systems.

No. of Terminals: 144

The high number of terminals allows for extensive connectivity options with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style with grid array, low profile, and fine pitch enables compact and high-density PCB designs.

Minimum Supply Voltage: 1.42 V

The low minimum supply voltage ensures stable operation even under low-power conditions.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature makes the product suitable for industrial environments with high heat levels.

No. of External Interrupts: 4

The presence of external interrupts allows for efficient handling of external events and real-time processing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and reliability in various environmental conditions.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB layout and assembly.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for slim and compact device designs.

RAM Words: 65536

The large RAM capacity enables efficient data storage and processing.

Width: 12 mm

The compact width of the product allows for space-efficient PCB integration.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging during production and maintenance.

External Data Bus Width: 16

The wide external data bus width facilitates high-speed data transfer between the processor and external devices.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency enables fast data processing and real-time operations.

Maximum Time At Peak Reflow Temperature (s): 20

The short reflow time helps in preventing thermal damage during assembly processes.

Peak Reflow Temperature °C: 220

The high peak reflow temperature ensures proper soldering and component integrity during assembly.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture allows for efficient data flow and processing within the processor.

Length: 12 mm

The compact length of the product enables space-saving PCB designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes the product suitable for harsh environmental conditions in industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatile peripheral IC type supports a wide range of digital signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's performance and reliability.

Terminal Form: BALL

The ball terminal form provides efficient connectivity and mechanical strength for reliable operation.

Nominal Supply Voltage: 1.5 V

The stable nominal supply voltage ensures consistent performance and power efficiency.

No. of DMA Channels: 6

The multiple DMA channels enable efficient data transfers and processing without CPU intervention.

ROM Programmability: MROM

MROM programmability offers secure and non-volatile storage for critical program code.

Terminal Pitch: 0.8 mm

The tight terminal pitch allows for high-density PCB designs and efficient signal routing.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and improves computational efficiency.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling and storage precautions.

Low Power Mode: YES

The low power mode helps in reducing power consumption during idle or low-load conditions.

Barrel Shifter: YES

The barrel shifter feature allows for efficient and fast shift operations in data processing.

On Chip Program ROM Width: 16

The wide on-chip program ROM width enables efficient storage of program code for quick access and execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5410AGGU12 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3/3.3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5410AGGU12 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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